Information

 2001 Microchip Technology Inc. DS80067C-page 11
PIC12C67X
8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S)
L
M
M
B
SOLDER
MASK
p
PACKAGE
EDGE
Pad Width
*Controlling Parameter
Drawing No. C04-2113
B .014 .016 .019 0.35 0.40 0.47
Pitch
MAX
Units
Dimension Limits
p
INCHES
.050 BSC
MIN NOM MAX
MILLIMETERS*
MIN
1.27 BSC
NOM
Pad Length
Pad to Solder Mask
L .020 .024 .030 0.50 0.60 0.75
M .005 .006 0.13 0.15