Information

PIC12C67X
DS80067C-page 10  2001 Microchip Technology Inc.
8. Module: PACKAGING INFORMATION
Added 8-Lead Plastic Micro Leadframe Package (MF)
and (MLF-S).
8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S)
NOM
.050 BSC
INCHES
.194 BSC
.184 BSC
.226 BSC
.236 BSC
.008 REF.
DOverall Width
JEDEC equivalent: pending
Notes:
Drawing No. C04-113
Molded Package Width
Lead Width
*Controlling Parameter
Mold Draft Angle Top
Tie Bar Width
Lead Length
R
α
B
L
D1
.014
.020
Dimension Limits
Molded Package Thickness
Pitch
Overall Height
Overall Length
Molded Package Length
Base Thickness
Standoff
Number of Pins
A3
E1
E
A2
A1
A
.000
Units
n
p
MIN
TOP VIEW
12
A2
A
5.99 BSC
.019
12
.030
.014
.016
.024
0.35
0.50
.356
0.40
0.60
5.74 BSC
12
0.47
0.75
MILLIMETERS*
.039
.002
.031
.026
.0004
.033
0.00
8
MAX MIN
1.27 BSC
0.20 REF.
4.92 BSC
4.67 BSC
0.85
0.01
0.65
0.80
0.05
1.00
MAXNOM
8
BOTTOM VIEW
n
E
E1
PIN 1
p
B
Exposed Pad Length E2
Exposed Pad Width D2 .085 .091 .097 2.16 2.31 2.46
.152 .158 .163 3.85 4.00 4.15
EXPOSED
METAL
PADS
D2
E2
A1
A3
α
L
ID
D1 D
R
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.