Datasheet
1997-2013 Microchip Technology Inc. DS30561C-page 117
PIC12C67X
8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC)
Foot Angle
048048
1512015120
Mold Draft Angle Bottom
1512015120
Mold Draft Angle Top
0.510.430.36.020.017.014BLead Width
0.250.230.20.010.009.008
c
Lead Thickness
0.760.640.51.030.025.020LFoot Length
5.335.215.13.210.205.202DOverall Length
5.385.285.11.212.208.201E1Molded Package Width
8.267.957.62.325.313.300EOverall Width
0.250.130.05.010.005.002A1Standoff
1.98.078A2Molded Package Thickness
2.03.080AOverall Height
1.27.050
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
A2
A
A1
L
c
2
1
D
n
p
B
E
E1
.070 .075
.069 .074
1.78
1.75
1.97
1.88
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
Drawing No. C04-056
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging