Datasheet

 1997-2013 Microchip Technology Inc. DS30561C-page 115
PIC12C67X
14.0 PACKAGING INFORMATION
14.1 Package Marking Information
MMMMMMMM
XXXXXCDE
AABB
8-Lead PDIP (300 mil)
Example
8-Lead Windowed Ceramic Side Brazed (300 mil)
Example
12CE674
04/PSAZ
9925
CE674
JW
MMMMMM
MM
Legend: MM...M Microchip part number information
XX...X Customer specific information*
AA Year code (last 2 digits of calendar year)
BB Week code (week of January 1 is week ‘01’)
C Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
D Mask revision number
E Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
MMMMMMM
XXXXXXX
AABBCDE
8-Lead SOIC (208 mil)
Example
12C671
04I/SM
9924SAZ