Datasheet

 1999 Microchip Technology Inc. DS40139E-page 99
PIC12C5XX
15.0 PACKAGING INFORMATION
15.1 Package Marking Information
Legend: MM...M Microchip part number information
XX...X Customer specific information*
AA Year code (last 2 digits of calendar year)
BB Week code (week of January 1 is week ‘01’)
C Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
D Mask revision number
E Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
XXXXXXXX
XXXXXCDE
AABB
8-Lead PDIP (300 mil)
Example
8-Lead SOIC (208 mil)
XXXXXXX
AABBCDE
XXXXXXX
8-Lead Windowed Ceramic Side Brazed (300 mil)
XXXXXX
XXX
Example
Example
12C508A
04I/PSAZ
9825
12C508A
9824SAZ
04I/SM
12C508A
JW
8-Lead SOIC (150 mil)
XXXXXXX
Example
AABB
C508A
9825