Datasheet

2011 Microchip Technology Inc. Preliminary DS41585A-page 195
PIC10(L)F320/322
27.2 Package Details
The following sections give the technical details of the packages.
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2YHUDOO+HLJKW $  ± 
0ROGHG3DFNDJH7KLFNQHVV $  ± 
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2YHUDOO:LGWK (  ± 
0ROGHG3DFNDJH:LGWK (  ± 
2YHUDOO/HQJWK '  ± 
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/HDG:LGWK E  ± 
b
E
4
N
E1
PIN 1 ID BY
LASER MARK
D
1
2
3
e
e1
A
A1
A2
c
L
L1
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