Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller SOT 23 6 8-Bit 8 MHz I/O number 4

Table Of Contents

Device Included In This Data Sheet:
High-Performance RISC CPU:
Special Microcontroller Features:
Low-Power Features/CMOS Technology:
Peripheral Features:
6-Lead SOT-23 Pin Diagram
8-Lead DIP Pin Diagram
8-Lead DFN Pin Diagram
Table of Contents
Most Current Data Sheet
Errata
Customer Notification System
1.0 General Description
- 1.1 Applications
  - TABLE 1-1: PIC10F220/222 Devices(1), (2)
2.0 Device Varieties
- 2.1 Quick Turn Programming (QTP) Devices
- 2.2 Serialized Quick Turn ProgrammingSM (SQTPSM) Devices
3.0 Architectural Overview
- FIGURE 3-1: Block Diagram
- TABLE 3-1: Pinout Description
- 3.1 Clocking Scheme/Instruction Cycle
- 3.2 Instruction Flow/Pipelining
  - FIGURE 3-2: Clock/Instruction Cycle
  - EXAMPLE 3-1: Instruction Pipeline Flow
4.0 Memory Organization
- 4.1 Program Memory Organization for the PIC10F220
  - FIGURE 4-1: Program Memory Map and Stack for the PIC10F220
- 4.2 Program Memory Organization for the PIC10F222
  - FIGURE 4-2: Program Memory Map and Stack for the PIC10F222
- 4.3 Data Memory Organization
  - 4.3.1 General Purpose Register File
    - FIGURE 4-3: PIC10F220 Register File Map
    - FIGURE 4-4: PIC10F222 Register File Map
  - 4.3.2 Special Function Registers
    - TABLE 4-1: Special Function Register (SFR) Summary
- 4.4 STATUS Register
  - Register 4-1: Status Register (Address: 03h)
- 4.5 OPTION Register
  - Register 4-2: Option Register
- 4.6 OSCCAL Register
  - Register 4-3: OSCCAL – Oscillator Calibration Register (Address: 05h)
- 4.7 Program Counter
  - FIGURE 4-5: Loading of PC Branch Instructions
  - 4.7.1 Effects Of Reset
- 4.8 Stack
- 4.9 Indirect Data Addressing; INDF and FSR Registers
  - 4.9.1 Indirect Addressing
    - EXAMPLE 4-1: How to Clear RAM Using Indirect Addressing
    - FIGURE 4-6: Direct/Indirect Addressing
5.0 I/O Port
- 5.1 GPIO
- 5.2 TRIS Registers
- 5.3 I/O Interfacing
- 5.4 I/O Programming Considerations
  - 5.4.1 Bidirectional I/O Ports
    - EXAMPLE 5-1: I/O Port Read-modify- write Instructions
  - 5.4.2 Successive Operations on I/O Ports
    - FIGURE 5-5: Successive I/O Operation
6.0 TMR0 Module and TMR0 Register
- FIGURE 6-1: TIMER0 Block Diagram
- FIGURE 6-2: TIMER0 Timing: Internal Clock/No Prescale
- FIGURE 6-3: TIMER0 Timing: Internal Clock/Prescale 1:2
- TABLE 6-1: Registers Associated With TIMER0
- 6.1 Using Timer0 With An External Clock
  - 6.1.1 External Clock Synchronization
  - 6.1.2 TIMER0 Increment Delay
    - FIGURE 6-4: TIMER0 Timing with External Clock
- 6.2 Prescaler
  - 6.2.1 Switching Prescaler Assignment
7.0 Analog-to-Digital (A/D) converter
- 7.1 Clock Divisors
- 7.2 Voltage Reference
- 7.3 Analog Mode Selection
- 7.4 A/D Converter Channel Selection
- 7.5 The GO/DONE bit
- 7.6 Sleep
  - TABLE 7-1: Effects of Sleep and Wake on ADCON0
- 7.7 Analog Conversion Result Register
- 7.8 Internal Absolute Voltage Reference
  - Register 7-1: ADCON0: A/D Converter 0 Register
  - Register 7-2: Adres: Analog Conversion Result Register
- 7.9 A/D Acquisition Requirements
  - EQUATION 7-1: Acquisition Time Example
  - FIGURE 7-1: aNALOG iNPUT mODULE
8.0 Special Features Of The CPU
- 8.1 Configuration Bits
  - Register 8-1: CONFIG: Configuration Word(1)
- 8.2 Oscillator Configurations
  - 8.2.1 Oscillator Types
  - 8.2.2 Internal 4/8 MHz Oscillator
- 8.3 Reset
- 8.4 Power-on Reset (POR)
- 8.5 Device Reset Timer (DRT)
  - TABLE 8-3: DRT (Device Reset Timer Period)
- 8.6 Watchdog Timer (WDT)
  - 8.6.1 WDT Period
  - 8.6.2 WDT Programming Considerations
    - FIGURE 8-6: Watchdog Timer Block Diagram
    - TABLE 8-4: Summary of Registers Associated with the Watchdog Timer
- 8.7 Time-out Sequence, Power-down and Wake-up from Sleep Status Bits (TO/PD/GPWUF/CWUF)
  - TABLE 8-5: TO/PD/GPWUF Status After Reset
- 8.8 Reset on Brown-out
- 8.9 Power-down Mode (Sleep)
  - 8.9.1 Sleep
  - 8.9.2 Wake-up from Sleep
- 8.10 Program Verification/Code Protection
- 8.11 ID Locations
- 8.12 In-Circuit Serial Programming™
  - FIGURE 8-10: Typical In-Circuit Serial Programming™ Connection
9.0 Instruction Set Summary
- TABLE 9-1: Opcode Field Descriptions
- FIGURE 9-1: General Format for Instructions
- TABLE 9-2: Instruction Set Summary
- 9.1 Instruction Description
10.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
  - FIGURE 10-1: Voltage-Frequency Graph, -40°C £ ta £ +125°C
- 10.1 DC Characteristics: PIC10F220/222 (Industrial)
- 10.2 DC Characteristics: PIC10F220/222 (Extended)
- 10.3 DC Characteristics: PIC10F220/222 (Industrial, Extended)
  - TABLE 10-1: Pull-up Resistor Ranges
- 10.4 Timing Parameter Symbology and Load Conditions
11.0 DC and AC Characteristics Graphs and Tables.
- FIGURE 11-1: Idd vs. Vdd Over Fosc (4 MHz)
- FIGURE 11-2: Idd vs. Vdd Over Fosc (8 MHz)
- FIGURE 11-3: Typical Ipd vs. Vdd (Sleep Mode, all Peripherals Disabled)
- FIGURE 11-4: Maximum Ipd vs. Vdd (Sleep Mode, all Peripherals Disabled)
- FIGURE 11-5: Typical WDT Ipd VS. Vdd
- FIGURE 11-6: Maximum WDT Ipd VS. Vdd Over Temperature
- FIGURE 11-7: WDT TIME-OUT VS. Vdd Over Temperature (No Prescaler)
- FIGURE 11-8: Vol VS. Iol Over Temperature (Vdd = 3.0V)
- FIGURE 11-9: Vol VS. Iol Over Temperature (Vdd = 5.0V)
- FIGURE 11-10: Voh VS. Ioh Over Temperature (Vdd = 3.0V)
- FIGURE 11-11: Voh VS. Ioh Over Temperature (Vdd = 5.0V)
- FIGURE 11-12: TTL Input Threshold Vin VS. Vdd
- FIGURE 11-13: Schmitt Trigger Input Threshold Vin VS. Vdd
12.0 Development Support
- 12.1 MPLAB Integrated Development Environment Software
- 12.2 MPASM Assembler
- 12.3 MPLAB C18 and MPLAB C30 C Compilers
- 12.4 MPLINK Object Linker/ MPLIB Object Librarian
- 12.5 MPLAB ASM30 Assembler, Linker and Librarian
- 12.6 MPLAB SIM Software Simulator
- 12.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator
- 12.8 MPLAB REAL ICE In-Circuit Emulator System
- 12.9 MPLAB ICD 2 In-Circuit Debugger
- 12.10 MPLAB PM3 Device Programmer
- 12.11 PICSTART Plus Development Programmer
- 12.12 PICkit 2 Development Programmer
- 12.13 Demonstration, Development and Evaluation Boards
13.0 Packaging Information
- 13.1 Package Marking Information
  - TABLE 13-1: 8-Lead 2X3 dfn (mc) tOP mARKINg
  - TABLE 13-2: 6-Lead SOT-23 (OT) Package tOP mARKINg
Appendix A: Revision History
- Revision A
- Revision B (03/2006)
- Revision C (08/2006)
- Revision D (02/2007)
- Revision E (06/2007)
INDEX
The Microchip Web Site
Customer Change Notification Service
Customer Support
Reader Response
Product Identification System
- Worldwide Sales and Service

PIC10F220/222

8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Package is saw singulated.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 8

Pitch e 0.50 BSC

Overall Height A 0.80 0.90 1.00

Standoff A1 0.00 0.02 0.05

Contact Thickness A3 0.20 REF

Overall Length D 2.00 BSC

Overall Width E 3.00 BSC

Exposed Pad Length D2 1.30 – 1.75

Exposed Pad Width E2 1.50 – 1.90

Contact Width b 0.18 0.25 0.30

Contact Length L 0.30 0.40 0.50

Contact-to-Exposed Pad K 0.20 – –

NOTE 1

EXPOSED PAD

NOTE 1

A3 A1

NOTE 2

BOTTOM VIEW

TOP VIEW

Microchip Technology Drawing C04-123B