Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller SOT 23 6 8-Bit 8 MHz I/O number 4

Table Of Contents

Device Included In This Data Sheet:
High-Performance RISC CPU:
Special Microcontroller Features:
Low-Power Features/CMOS Technology:
Peripheral Features:
6-Lead SOT-23 Pin Diagram
8-Lead DIP Pin Diagram
8-Lead DFN Pin Diagram
Table of Contents
Most Current Data Sheet
Errata
Customer Notification System
1.0 General Description
- 1.1 Applications
  - TABLE 1-1: PIC10F220/222 Devices(1), (2)
2.0 Device Varieties
- 2.1 Quick Turn Programming (QTP) Devices
- 2.2 Serialized Quick Turn ProgrammingSM (SQTPSM) Devices
3.0 Architectural Overview
- FIGURE 3-1: Block Diagram
- TABLE 3-1: Pinout Description
- 3.1 Clocking Scheme/Instruction Cycle
- 3.2 Instruction Flow/Pipelining
  - FIGURE 3-2: Clock/Instruction Cycle
  - EXAMPLE 3-1: Instruction Pipeline Flow
4.0 Memory Organization
- 4.1 Program Memory Organization for the PIC10F220
  - FIGURE 4-1: Program Memory Map and Stack for the PIC10F220
- 4.2 Program Memory Organization for the PIC10F222
  - FIGURE 4-2: Program Memory Map and Stack for the PIC10F222
- 4.3 Data Memory Organization
  - 4.3.1 General Purpose Register File
    - FIGURE 4-3: PIC10F220 Register File Map
    - FIGURE 4-4: PIC10F222 Register File Map
  - 4.3.2 Special Function Registers
    - TABLE 4-1: Special Function Register (SFR) Summary
- 4.4 STATUS Register
  - Register 4-1: Status Register (Address: 03h)
- 4.5 OPTION Register
  - Register 4-2: Option Register
- 4.6 OSCCAL Register
  - Register 4-3: OSCCAL – Oscillator Calibration Register (Address: 05h)
- 4.7 Program Counter
  - FIGURE 4-5: Loading of PC Branch Instructions
  - 4.7.1 Effects Of Reset
- 4.8 Stack
- 4.9 Indirect Data Addressing; INDF and FSR Registers
  - 4.9.1 Indirect Addressing
    - EXAMPLE 4-1: How to Clear RAM Using Indirect Addressing
    - FIGURE 4-6: Direct/Indirect Addressing
5.0 I/O Port
- 5.1 GPIO
- 5.2 TRIS Registers
- 5.3 I/O Interfacing
- 5.4 I/O Programming Considerations
  - 5.4.1 Bidirectional I/O Ports
    - EXAMPLE 5-1: I/O Port Read-modify- write Instructions
  - 5.4.2 Successive Operations on I/O Ports
    - FIGURE 5-5: Successive I/O Operation
6.0 TMR0 Module and TMR0 Register
- FIGURE 6-1: TIMER0 Block Diagram
- FIGURE 6-2: TIMER0 Timing: Internal Clock/No Prescale
- FIGURE 6-3: TIMER0 Timing: Internal Clock/Prescale 1:2
- TABLE 6-1: Registers Associated With TIMER0
- 6.1 Using Timer0 With An External Clock
  - 6.1.1 External Clock Synchronization
  - 6.1.2 TIMER0 Increment Delay
    - FIGURE 6-4: TIMER0 Timing with External Clock
- 6.2 Prescaler
  - 6.2.1 Switching Prescaler Assignment
7.0 Analog-to-Digital (A/D) converter
- 7.1 Clock Divisors
- 7.2 Voltage Reference
- 7.3 Analog Mode Selection
- 7.4 A/D Converter Channel Selection
- 7.5 The GO/DONE bit
- 7.6 Sleep
  - TABLE 7-1: Effects of Sleep and Wake on ADCON0
- 7.7 Analog Conversion Result Register
- 7.8 Internal Absolute Voltage Reference
  - Register 7-1: ADCON0: A/D Converter 0 Register
  - Register 7-2: Adres: Analog Conversion Result Register
- 7.9 A/D Acquisition Requirements
  - EQUATION 7-1: Acquisition Time Example
  - FIGURE 7-1: aNALOG iNPUT mODULE
8.0 Special Features Of The CPU
- 8.1 Configuration Bits
  - Register 8-1: CONFIG: Configuration Word(1)
- 8.2 Oscillator Configurations
  - 8.2.1 Oscillator Types
  - 8.2.2 Internal 4/8 MHz Oscillator
- 8.3 Reset
- 8.4 Power-on Reset (POR)
- 8.5 Device Reset Timer (DRT)
  - TABLE 8-3: DRT (Device Reset Timer Period)
- 8.6 Watchdog Timer (WDT)
  - 8.6.1 WDT Period
  - 8.6.2 WDT Programming Considerations
    - FIGURE 8-6: Watchdog Timer Block Diagram
    - TABLE 8-4: Summary of Registers Associated with the Watchdog Timer
- 8.7 Time-out Sequence, Power-down and Wake-up from Sleep Status Bits (TO/PD/GPWUF/CWUF)
  - TABLE 8-5: TO/PD/GPWUF Status After Reset
- 8.8 Reset on Brown-out
- 8.9 Power-down Mode (Sleep)
  - 8.9.1 Sleep
  - 8.9.2 Wake-up from Sleep
- 8.10 Program Verification/Code Protection
- 8.11 ID Locations
- 8.12 In-Circuit Serial Programming™
  - FIGURE 8-10: Typical In-Circuit Serial Programming™ Connection
9.0 Instruction Set Summary
- TABLE 9-1: Opcode Field Descriptions
- FIGURE 9-1: General Format for Instructions
- TABLE 9-2: Instruction Set Summary
- 9.1 Instruction Description
10.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
  - FIGURE 10-1: Voltage-Frequency Graph, -40°C £ ta £ +125°C
- 10.1 DC Characteristics: PIC10F220/222 (Industrial)
- 10.2 DC Characteristics: PIC10F220/222 (Extended)
- 10.3 DC Characteristics: PIC10F220/222 (Industrial, Extended)
  - TABLE 10-1: Pull-up Resistor Ranges
- 10.4 Timing Parameter Symbology and Load Conditions
11.0 DC and AC Characteristics Graphs and Tables.
- FIGURE 11-1: Idd vs. Vdd Over Fosc (4 MHz)
- FIGURE 11-2: Idd vs. Vdd Over Fosc (8 MHz)
- FIGURE 11-3: Typical Ipd vs. Vdd (Sleep Mode, all Peripherals Disabled)
- FIGURE 11-4: Maximum Ipd vs. Vdd (Sleep Mode, all Peripherals Disabled)
- FIGURE 11-5: Typical WDT Ipd VS. Vdd
- FIGURE 11-6: Maximum WDT Ipd VS. Vdd Over Temperature
- FIGURE 11-7: WDT TIME-OUT VS. Vdd Over Temperature (No Prescaler)
- FIGURE 11-8: Vol VS. Iol Over Temperature (Vdd = 3.0V)
- FIGURE 11-9: Vol VS. Iol Over Temperature (Vdd = 5.0V)
- FIGURE 11-10: Voh VS. Ioh Over Temperature (Vdd = 3.0V)
- FIGURE 11-11: Voh VS. Ioh Over Temperature (Vdd = 5.0V)
- FIGURE 11-12: TTL Input Threshold Vin VS. Vdd
- FIGURE 11-13: Schmitt Trigger Input Threshold Vin VS. Vdd
12.0 Development Support
- 12.1 MPLAB Integrated Development Environment Software
- 12.2 MPASM Assembler
- 12.3 MPLAB C18 and MPLAB C30 C Compilers
- 12.4 MPLINK Object Linker/ MPLIB Object Librarian
- 12.5 MPLAB ASM30 Assembler, Linker and Librarian
- 12.6 MPLAB SIM Software Simulator
- 12.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator
- 12.8 MPLAB REAL ICE In-Circuit Emulator System
- 12.9 MPLAB ICD 2 In-Circuit Debugger
- 12.10 MPLAB PM3 Device Programmer
- 12.11 PICSTART Plus Development Programmer
- 12.12 PICkit 2 Development Programmer
- 12.13 Demonstration, Development and Evaluation Boards
13.0 Packaging Information
- 13.1 Package Marking Information
  - TABLE 13-1: 8-Lead 2X3 dfn (mc) tOP mARKINg
  - TABLE 13-2: 6-Lead SOT-23 (OT) Package tOP mARKINg
Appendix A: Revision History
- Revision A
- Revision B (03/2006)
- Revision C (08/2006)
- Revision D (02/2007)
- Revision E (06/2007)
INDEX
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PIC10F220/222

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X /XX XXX

PatternPackageTemperature

Range

Device

Device: PIC10F220

PIC10F222

PIC10F220T (Tape & Reel)

PIC10F222T (Tape & Reel)

Temperature

Range:

I= -40°C to +85°C (Industrial)

E= -40°C to +125°C (Extended)

Package: P = 300 mil PDIP (Pb-free)

OT = SOT-23, 6-LD (Pb-free)

MC = DFN, 8-LD 2x3 (Pb-free)

Pattern: Special Requirements

Examples:

a) PIC10F220-I/P = Industrial temp., PDIP

package (Pb-free)

b) PIC10F222T-E/OT = Extended temp., SOT-23

package (Pb-free), Tape and Reel

c) PIC10F222-E/MC = Extended temp., DFN

package (Pb-free)