Datasheet

MTS62C19A
DS22260C-page 14  2010-2013 Microchip Technology Inc.
SOP 24L Package Outline
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
112
1324
0.016 typ
0.05 typ
D
L
GAUGE PLANE
SEATING PLANE
Symbol Minimum Typical Maximum Unit
A — — 2.642 (0.104) mm (inch)
A1 0.102 (0.004) — — mm (inch)
D 15.545 (0.612) 15.697 (0.618) 15.850 (0.624) mm (inch)
E 7.417 (0.292) 7.518 (0.296) 7.595 (0.299) mm (inch)
H 10.287 (0.405) 10.464 (0.412) 10.643 (0.419) mm (inch)
L 0.533 (0.021) 0.787 (0.031) 1.041 (0.041) mm (inch)
J048°
Note 1: JEDEC outline: M0-119 AA
2: Dimensions “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions
and gate burrs should not exceed 0.25mm (0.010inch) per side.
3: Dimensions “E” does not include inter-lead flash, or protrusions. Inter-lead flash and protrusions
shall not exceed 0.25mm (0.010 inch) per side.
Note: The package drawing dimensions are expressed in inches.