Datasheet

 2012 Microchip Technology Inc. DS41663A-page 21
MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER
8.0 ELECTRICAL
CHARACTERISTICS
This section provides an overview of the MTCH6301
electrical characteristics.
8.1 Absolute Maximum Ratings
Absolute maximum ratings for the MTCH6301 device
are listed below. Exposure to these maximum rating
conditions for extended periods may affect device reli-
ability. Functional operation of the device at these or
any other conditions, above the parameters indicated
in the operation listings of this specification, is not
implied.
Ambient temperature under bias …………………………………………………..................….....……..............-40 to +85°C
Storage temperature……………………………………………………………….......................…...…….………-65 to 150°C
Voltage on V
DD with respect to VSS……………………………....…………………….............................………-0.3V to 4.0V
Voltage on all other pins with respect to V
SS………………………………………..…...............………-0.3V to (VDD + 0.3V)
Maximum current out of V
SS pin …..……………………………………………………..........……………...............…300 mA
Maximum current into V
DD pin(s) ……….………………………………………………………..........…………………300 mA
Maximum output current sunk by any I/O pin…………………………………………………..................………………15 mA
Maximum output current sourced by any I/O pin …………………………………………………...................…………15 mA
Maximum current sunk by all ports. …………………………………………………………………….............………. 200 mA
Maximum current sourced by all ports. ………………………………………………………………………................ 200 mA
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at those or any other conditions, above those indicated in the
operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
8.2 DC Characteristics
TABLE 8-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min. Typ. Max. Units
Operating Junction Temperature Range TJ -40 — +125 ⁰C
Operating Ambient Temperature Range TA -40 — +85 ⁰C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD-Ʃ IOH)
I/O Pin Power Dissipation:
PI/O = Ʃ (({VDD - VOH} x IOH) + Ʃ (VOL x IOL))
PD PINT + PI/O W
Maximum Allows Power Dissipation PDMAX (TJ - TA) / θJA W
TABLE 8-2: THERMAL PACKAGING CHARACTERISTICS
Characteristics Symbol Typ. Max. Units
Package Thermal Resistance, 44-pin QFN θJA 32 — ⁰C/W
Package Thermal Resistance, 44-pin TQFP θJA 45 — ⁰C/W
TABLE 8-3: OPERATING VOLTAGE AND CURRENT
Symbol Characteristics Min Typ Max Units
V
DD Supply Voltage 2.4 — 3.6 V
I
DD Operating Current — 20 30 mA
I
SLP Sleep Current — 20 — µA