User's Manual

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 12
MRF89XAM9A
2.2 Printed Circuit Board
The MRF89XAM9A module PCB is constructed with
high temperature FR4 material, four layers and 0.032
inches thick. The layers are shown in Figure 2-3
through Figure 2-8. The stack up of the PCB is shown
in Figure 2-9
FIGURE 2-3: TOP SILK SCREEN
FIGURE 2-4: TOP COPPER
FIGURE 2-5: LAYER 2 — GROUND
PLANE
FIGURE 2-6: LAYER 3 — POWER
PLANE