Datasheet

MRF89XAM8A
DS70651A-page 12 Preliminary © 2010 Microchip Technology Inc.
2.2 Printed Circuit Board
The MRF89XAM8A module PCB is constructed with
high temperature FR4 material, 4 layers and 0.032
inches thick. These layers are shown in Figure 2-3
through Figure 2-8. The stack up of the PCB is shown
in Figure 2-9
FIGURE 2-3: TOP SILK SCREEN
FIGURE 2-4: TOP COPPER
FIGURE 2-5: LAYER 2 — GROUND
PLANE
FIGURE 2-6: LAYER 3 — POWER
PLANE