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MRF89XAM8A

Data Sheet

868 MHz Ultra-Low Power

Sub-GHz Transceiver Module

Summary of content (34 pages)

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Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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MRF89XAM8A 868 MHz Ultra-Low Power Sub-GHz Transceiver Module Features RF/Analog Features • Module designed from the MRF89XA integrated ultra low-power, sub-GHz transceiver IC. • Supports proprietary sub-GHz wireless protocols • Simple, SPI Interface with Interrupts • Small size: 0.7" x 1.1" (17.8 mm x 27.
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MRF89XAM8A Table of Contents .0 Device Overview .......................................................................................................................................................................... 3 2.0 Circuit Description ........................................................................................................................................................................ 9 3.0 Regulatory Approval ........................................................................
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MRF89XAM8A 1.0 DEVICE OVERVIEW 1.1 The simplified block diagram of the MRF89XAM8A module is illustrated in Figure 1-1. The module is based on the Microchip Technology MRF89XA ultra-low power sub-GHz transceiver Integrated Circuit (IC).
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MRF89XAM8A TABLE 1-1: PIN DESCRIPTION Pin Symbol Type Description 1 GND Power Ground 2 RESET DI Reset Pin 3 CSCON DI Serial Interface Configure Chip Select 4 IRQ0 DO Interrupt Request Output 5 SDI DI Serial Interface Data Input 6 SCK DI Serial Interface Clock 7 SDO DO Serial Interface Data Output 8 CSDATA DI Serial Interface Data Chip Select 9 IRQ1 DO Interrupt Request Output 10 Vin Power Power Supply 11 GND Power Ground 12 GND Power Ground FIGURE 1-2:
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MRF89XAM8A 1.2 Mounting Details The MRF89XAM8A is a surface mountable module, the module dimensions are illustrated in Figure 1-3. The module PCB is 0.032" thick with castellated mounting holes on the edge. Figure 1-4 is the recommended host PCB footprint for the MRF89XAM8A. The MRF89XAM8A has an integrated PCB antenna. For the best performance, follow the mounting details as illustrated in Figure 1-5.
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MRF89XAM8A FIGURE 1-5: MOUNTING DETAILS Keep area around antenna (approximately 3.4 inches (8.6 cm)) clear of metallic structures for best performance. 3.4” Edge of PCB 3.4” 0.470” 0.4” 0.4” Host PCB Top Copper Ground Plane (Antenna Counterpoise): Extend the host PCB top copper ground plane under and to the left and right side of the module at least 0.4 inches (1 cm) for best antenna performance. © 2010 Microchip Technology Inc.
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MRF89XAM8A 1.3 Operation 1.3.4 The MRF89XAM8A module is based on the Microchip Technology MRF89XA ultra-low power, integrated ISM band sub-GHz transceiver IC. Serial communication and module configuration are documented in the “MRF89XA Ultra-Low Power, Integrated ISM Band Sub-GHz Transceiver Data Sheet” (DS70622).
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MRF89XAM8A 2.0 CIRCUIT DESCRIPTION Figure 2-2 illustrates the MRF89XAM8A schematics. Table 2-1 details the Bill of Materials (BOM). The MRF89XAM8A module interfaces to Microchip’s PIC16, PIC18, PIC24, dsPIC33 and PIC32 microcontrollers with a minimum of external components through digital only connections. An example application schematic is illustrated in Figure 2-1. 2.
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MRF89XAM8A DS70651A-page 10 Preliminary Designators not used: C6, L5 Note: MRF89XAM8A SCHEMATIC FIGURE 2-2: © 2010 Microchip Technology Inc.
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MRF89XAM8A TABLE 2-1: MRF89XAM8A BILL OF MATERIALS Designator Value Description Manufacturer Part Number C1 0.047 µF Capacitor, Ceramic, 10V, ±10%, X7R, SMT 0402 Murata GRM155R71A473KA 01D C2 0.22 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT 0402 Murata GRM155R71C224KA 12D C3 1 µF Capacitor, Ceramic, 6.3V, ±10%, X5R, SMT 0603 Murata GRM188R60J105KA 01D C4 22 pF Capacitor, Ceramic, 50V, ±5%, UHI-Q NP0, Johanson Technology SMT 0402 C5 1.8 pF Capacitor, Ceramic, 50V, ±0.
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MRF89XAM8A 2.2 Printed Circuit Board FIGURE 2-5: LAYER 2 — GROUND PLANE FIGURE 2-6: LAYER 3 — POWER PLANE The MRF89XAM8A module PCB is constructed with high temperature FR4 material, 4 layers and 0.032 inches thick. These layers are shown in Figure 2-3 through Figure 2-8. The stack up of the PCB is shown in Figure 2-9 FIGURE 2-3: FIGURE 2-4: DS70651A-page 12 TOP SILK SCREEN TOP COPPER Preliminary © 2010 Microchip Technology Inc.
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MRF89XAM8A FIGURE 2-9: PCB LAYER STACK UP 1/2 oz. Copper Top Copper 8 mil FR4 1/2 oz. Copper Ground Plane 0.032” ± 0.005” 12 mil FR4 1/2 oz. Copper Power Plane 8 mil FR4 1/2 oz. Copper 2.3 PCB Antenna Bottom Copper FIGURE 2-10: The PCB antenna is fabricated on the top copper trace. Figure 2-10 illustrates the trace dimensions. The layers below the antenna have no copper traces. The ground and power planes under the components serve as a counterpoise to the PCB antenna.
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MRF89XAM8A FIGURE 2-11: PCB ANTENNA SIMULATION DRAWING FIGURE 2-12: SIMULATED 2D RADIATION PATTERN © 2010 Microchip Technology Inc.
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MRF89XAM8A FIGURE 2-13: SIMULATED 3D RADIATION PATTERN FIGURE 2-14: SIMULATED PCB ANTENNA IMPEDANCE DS70651A-page 16 Preliminary © 2010 Microchip Technology Inc.
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MRF89XAM8A 3.0 REGULATORY APPROVAL 3.1 Europe 3.1.1 The MRF89XAM8A module conforms to the emission and immunity standards summarized in Table 3-1. The module tests can be applied toward final product certification and DoC. Note: To maintain conformance tested ETSI standards, the module shall not be modified and settings in Section 1.3, Operation must be observed. The European Standards do not provide a modular approval similar to the USA (FCC) and Canada (IC).
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MRF89XAM8A 4.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Ambient temperature under bias.............................................................................................................. -40°C to +85°C Storage temperature .............................................................................................................................. -55°C to +125°C Voltage on VIN with respect to VSS .........................................................................................
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MRF89XAM8A TABLE 4-1: RECOMMENDED OPERATING CONDITIONS Parameter Min Typ Max Unit Condition Ambient Operating Temperature -40 — +85 °C — Supply Voltage for RF, Analog and Digital Circuits 2.1 — 3.6 V — Supply Voltage for Digital I/O 2.1 — 3.6 V — Input High Voltage (VIH) 0.5 * VIN — VIN + 0.3 V — Input Low Voltage (VIL) -0.3V — 0.2 * VIN V — — VIN + 1.5 V — AC Peak Voltage on Open Collector Outputs (IO)(1) VIN – 1.5 Note 1: At minimum, VIN – 1.
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MRF89XAM8A TABLE 4-4: Symbol PLL PARAMETERS AC CHARACTERISTICS(1) Parameter Min Typ Max Unit Frequency Ranges 863 — 870 MHz BRFSK Bit Rate (FSK) 1.56 — 40 kbps NRZ BROOK Bit Rate (OOK) 1.56 — 16 kbps NRZ FDFSK Frequency Deviation (FSK) 33 50 200 kHz — FXTAL Crystal Oscillator Frequency 9 12.8 — MHz — FSSTP Frequency Synthesizer Step — 2 — kHz Variable, depending on the frequency TSOSC Oscillator Wake-up Time — 1.
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MRF89XAM8A RECEIVER AC CHARACTERISTICS(1) TABLE 4-5: Symbol RSF RSO Parameter Min Typ Max Unit Condition Sensitivity (FSK) — -107 — dBm 869 MHz, BR = 25 kbps, fdev = 50 kHz, fc = 100 kHz — -103 — dBm 869 MHz, BR = 66.7 kbps, fdev = 100 kHz, fc = 200 kHz — -113 — dBm 869 MHz, 2 kbps NRZ fc – fo = 50 kHz, fo = 50 kHz — -106 — dBm 869 MHz, 16.
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MRF89XAM8A TABLE 4-6: Symbol RFOP PN TXSP TRANSMITTER AC CHARACTERISTICS(1) Description Min Typ Max Unit Condition RF Output Power, Programmable with 8 Steps of typ. 3 dB — +12.5 — dBm Maximum power setting — -8.
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MRF89XAM8A 4.
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MRF89XAM8A APPENDIX A: REVISION HISTORY Revision A (November 2010) This is the Initial release of the document. © 2010 Microchip Technology Inc.
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MRF89XAM8A THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
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MRF89XAM8A READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
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MRF89XAM8A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office. PART NO Device M X Module Module Type T Example: -X Tape and Temperature Reel Range Device MRF89XAM8A-I/RM: Ultra Low-Power, Integrated ISM Band Sub-GHz Transceiver module Temperature Range I a) MRF89XAM8A-I/RM: Industrial temperature tray.
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