User Manual
Table Of Contents
- Features:
- Operational:
- RF/Analog Features:
- MAC/Baseband Features:
- Pin Diagram:
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Circuit Description
- 3.0 Regulatory Approval
- 4.0 Electrical Characteristics
- Appendix A: Revision History
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
- Product Identification System
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 15
MRF24J40MC
2.3 Printed Circuit Board
The MRF24J40MC module PCB is constructed with
high temperature FR4 material, four layers and
0.032 inches thick. The layers are illustrated in
Figure 2-3 through Figure 2-7. The stack up of the PCB
is illustrated in Figure 2-9.
FIGURE 2-3: TOP SILK SCREEN
FIGURE 2-4: TOP COPPER
FIGURE 2-5: LAYER 2 – GROUND
PLANE
FIGURE 2-6: LAYER 3 – POWER
PLANE