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Table Of Contents

MRF24J40MC

Data Sheet

2.4 GHz IEEE Std. 802.15.4™ RF

Transceiver Module with PA/LNA External

Antenna Connector

Summary of content (34 pages)

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MRF24J40MC Data Sheet 2.4 GHz IEEE Std. 802.15.4™ RF Transceiver Module with PA/LNA External Antenna Connector © 2011 Microchip Technology Inc.
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Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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MRF24J40MC 2.4 GHz IEEE Std. 802.15.4™ RF Transceiver Module with PA/LNA and External Antenna Connector Features: RF/Analog Features: • IEEE Std. 802.15.4™ Compliant RF Transceiver • Supports ZigBee®, MiWi™ Development Environment Proprietary Wireless Networking Protocols • Small 0.9" x 1.3" (22.9 mm x 33.
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MRF24J40MC Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 3 2.0 Circuit Description ...................................................................................................................................................................... 11 3.0 Regulatory Approval ........................................................................
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MRF24J40MC 1.0 DEVICE OVERVIEW The MRF24J40MC is a 2.4 GHz IEEE Std. 802.15.4™ compliant, surface mount module with integrated crystal, internal voltage regulator, matching circuitry, Power Amplifier (PA), Low Noise Amplifier (LNA) with 50Ω external antenna connector. The MRF24J40MC module operates in the non-licensed 2.4 GHz frequency band. The integrated module design frees the integrator from extensive RF and antenna design, and regulatory compliance testing, allowing quicker time to market.
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MRF24J40MC TABLE 1-1: PIN DESCRIPTION Pin Symbol Type Description 3 WAKE DI 4 INT DO Interrupt pin to microcontroller 5 SDI DI Serial interface data input External wake-up trigger 6 SCK DI Serial interface clock 7 SDO DO Serial interface data output from MRF24J40 8 CS DI Serial interface enable 9 NC — No connection 10 VIN Power Power supply 11 GND Ground Ground 12 GND Ground Ground Legend: Pin type abbreviation: D = Digital, I = Input, O = Output FIGURE 1-2: M
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MRF24J40MC 1.2 Mounting Details The MRF24J40MC is a surface mountable module. Module dimensions are shown in Figure 1-3. The module Printed Circuit Board (PCB) is 0.032" thick with castellated mounting points on the edge. Figure 1-4 is a recommended host PCB footprint for the MRF24J40MC . FIGURE 1-3: The MRF24J40MC has 50Ω ultra miniature coaxial (U.FL) connector. MODULE DETAILS © 2011 Microchip Technology Inc.
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MRF24J40MC 1.3 Operation The MRF24J40MC module is based on the Microchip Technology MRF24J40 2.4 GHz IEEE 802.15.4 RF Transceiver IC. Serial communication and configuration are documented in the “MRF24J40 Data Sheet” (DS39776). The internal RF state machine is configured for the PA/ LNA mode by setting TESTMODE (0x22<2:0>) = 111. Pins GPIO1 and GPIO2 control the RF switches, PA and LNA automatically when the MRF24J40 receives and transmits data.
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MRF24J40MC 1.3.2 ENERGY DETECTION (ED) 1.3.3 SLEEP Before performing an energy detection (see Section 3.6.1 “RSSI Firmware Request (RSSI Mode 1)” in the “MRF24J40 Data Sheet” (DS39776)), perform the following steps: To get the lowest power consumption from the MRF24J40MC module during Sleep, it is necessary to disable the PA, PA voltage regulator and LNA. To do this, perform the following steps: 1. 1. 2. 3. 4.
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MRF24J40MC 1.3.4 TRANSMIT POWER SETTINGS Table 1-2 lists the power settings in register RFCON3 (0x203<7:3>) and the output power at antenna connector J1. TABLE 1-2: TRANSMIT POWER SETTINGS RFCON3 (0x203<7:3>) MRF24J40 Power Setting Output Power(1) (dBm) 11111 –36.3 –26.4 11110 –34.9 –25.2 11101 –33.7 –24.1 11100 –32.8 –23.4 11011 –31.9 –22.7 11010 –31.2 –22.4 11001 –30.5 –21.9 11000 –30.0 –21.6 10111 –26.3 –15.7 10110 –24.9 –14.5 10101 –23.7 –13.7 10100 –22.8 –12.
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MRF24J40MC 2.0 CIRCUIT DESCRIPTION 2.2 The MRF24J40MC is a 2.4 GHz IEEE Std. 802.15.4™ compliant surface mount module with integrated crystal, internal voltage regulator, matching circuitry, power amplifier, low noise amplifier with 50Ω external antenna connector. The MRF24J40MC module interfaces to many popular Microchip PIC microcontrollers through a 4-wire SPI Interface, interrupt, wake, reset, power and ground. An example application schematic is illustrated in Figure 2-1.
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MRF24J40MC TABLE 2-1: MRF24J40MC BILL OF MATERIALS Designator Value C27, C31 0.5 pF Capacitor, Ceramic, 50V, Johanson Technology 500R07S0R5BV4T ±0.1 pF, UHI Q NP0, SMT 0402 do not substitute C25 0.7 pF Capacitor, Ceramic, 50V, Johanson Technology 500R07S0R7BV4T ±0.1 pF, UHI Q NP0, SMT 0402 do not substitute C1, C15 1.0 pF Capacitor, Ceramic, 50V, ±0.25 pF, HI-Q C0G, SMT 0402 C9 1.2 pF Capacitor, Ceramic, 50V, Johanson Technology 500R07S1R2BV4T ±0.1 pF, UHI Q NP0, SMT 0402 C2 1.
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MRF24J40MC TABLE 2-1: MRF24J40MC BILL OF MATERIALS (CONTINUED) Designator Value Description Manufacturer Part Number Comments L1, L2, L3 2.4 nH Inductor, Ceramic, ±0.3 nH, SMT 0402 Johanson Technology L-07C2N4SV6T do not substitute L8 2.7 nH Inductor, Ceramic, ±0.3 nH, SMT 0402 Johanson Technology L-07C2N7SV6T do not substitute L10 3.3 nH Inductor, Ceramic, ±0.3 nH, SMT 0402 Johanson Technology L-07C3N3SV6T do not substitute L6 3.9 nH Inductor, Ceramic, ±0.
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MRF24J40MC 2.3 Printed Circuit Board FIGURE 2-5: LAYER 2 – GROUND PLANE FIGURE 2-6: LAYER 3 – POWER PLANE The MRF24J40MC module PCB is constructed with high temperature FR4 material, four layers and 0.032 inches thick. The layers are illustrated in Figure 2-3 through Figure 2-7. The stack up of the PCB is illustrated in Figure 2-9. FIGURE 2-3: FIGURE 2-4: TOP SILK SCREEN TOP COPPER © 2011 Microchip Technology Inc.
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MRF24J40MC FIGURE 2-7: BOTTOM COPPER FIGURE 2-9: PCB LAYER STACK UP FIGURE 2-8: 1/2 oz. Copper BOTTOM SILK SCREEN Top Copper 8 mil FR4 1/2 oz. Copper Ground Plane 0.032” ±0.005” 12 mil FR4 1/2 oz. Copper Power Plane 8 mil FR4 1/2 oz. Copper DS00000A-page 16 Preliminary Bottom Copper © 2011 Microchip Technology Inc.
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MRF24J40MC 3.0 REGULATORY APPROVAL The MRF24J40MC module has received regulatory approvals for modular devices in the United States and Canada. Modular approval allows the end user to place the MRF24J40MC module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter), provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the equipment.
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MRF24J40MC 3.1.1 MRF24J40MC SETTINGS To meet the FCC requirements, the following settings must be observed by the integrator: • The MRF24J40MC transmit power setting shall not exceed 18.5 dBm (RFCON3 0x203<7:3> = 00101). Refer to Section 1.3.4, Transmit Power Settings. • Only channels 11 through 25 may be selected (RFCON0 0x200). 3.1.2 APPROVED EXTERNAL ANTENNA TYPES To maintain modular approval in the United States, only the antenna types that have been tested shall be used.
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MRF24J40MC 3.2 3.2.2 Canada The MRF24J40MC module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010): The host device shall be properly labeled to identify the module within the host device.
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MRF24J40MC User manuals for transmitters equipped with detachable antennas shall also contain the following notice in a conspicuous location. This radio transmitter (identify the device by certification number, or model number if Category II) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated.
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MRF24J40MC 3.3 Europe The MRF24J40MC module conforms to the emission standards summarized in Table 3-3. The module tests can be applied toward product Declaration of Conformity (DoC). Note: To maintain conformance tested ETSI standards, the module shall not be modified and settings in Section 1.3, Operation must be observed. The European Standards do not provide a modular approval similar to the USA (FCC) and Canada (IC).
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MRF24J40MC 3.3.1 MRF24J40MC SETTINGS 3.3.3 To meet ETSI requirements, the following settings must be observed by the integrator: • The MRF24J40MC transmit power setting shall not exceed 10.7 dBm (RFCON3 0x203<7:3> = 00111). Refer to Section 1.3.4, Transmit Power Settings. This is to meet the requirements of ETSI EN 300 328 v1.7.1 (2006-10), Maximum e.i.r.p. spectral density limit, Section 4.3.2.2, “For wideband modulations other then FHSS (DSSS, OFDM, etc.), the maximum e.i.r.p.
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MRF24J40MC 3.4 3.4.2 Australia/New Zealand The MRF24J40MC module conforms to compliance levels 1, 2 and 3 in Australia and levels of conformity 1, 2 and 3 in New Zealand as required by notices under: • Section 182 of the Australian Radiocommunications Act 1992; • Section 407 of the Australian Telecommunications Act 1997; and • Section 134 of the New Zealand Radiocommunications Act 1989. 3.4.
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MRF24J40MC 4.0 ELECTRICAL CHARACTERISTICS TABLE 4-1: RECOMMENDED OPERATING CONDITIONS Parameters Min Typ Max Units Ambient Operating Temperature –40 — +85 °C Supply Voltage for RF, Analog and Digital Circuits 2.7 — 3.6 V Supply Voltage for Digital I/O 2.7 3.3 3.6 V Input High Voltage (VIH) 0.5 x VDD — VDD + 0.3 V Input Low Voltage (VIL) –0.3 — 0.2 x VDD V TABLE 4-2: CURRENT CONSUMPTION (TA = 25°C, VDD = 3.
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MRF24J40MC TABLE 4-4: TRANSMITTER AC CHARACTERISTICS Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz Parameters Condition Min Typ Max Units RF Carrier Frequency — 2.405 — 2.475 GHz — dBm Maximum RF Output Power 50Ω — RF Output Power Control Range — — 56 — dB TX Gain Control Resolution Programmed by Register — 1.25 — dB — — –0 — dBc Offset Frequency >3.
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MRF24J40MC APPENDIX A: REVISION HISTORY Revision A (February 2011) This is the initial release of the document. © 2011 Microchip Technology Inc.
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MRF24J40MC THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
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MRF24J40MC READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
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MRF24J40MC PRODUCT IDENTIFICATION SYSTEM To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office. PART NO M X T Example: -X a) b) Device Module Module Type Tape and Temperature Reel Range Device MRF24J40MC: 2.4 GHz IEEE Std. 802.15.4 RF Transceiver Module with PA/LNA External Antenna Connector Temperature Range I PIC18F1220/1320-I/MQ: temperature, tray. MRF24J40MCT-I/RM: temperature, tape and reel.
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