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MRF24J40MA

Data Sheet

2.4 GHz IEEE Std. 802.15.4

™

RF Transceiver Module

Summary of content (30 pages)

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Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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MRF24J40MA 2.4 GHz IEEE Std. 802.15.4™ RF Transceiver Module Features: RF/Analog Features: • IEEE Std. 802.15.4™ Compliant RF Transceiver • Supports ZigBee®, MiWi™, MiWi™ P2P and Proprietary Wireless Networking Protocols • Small Size: 0.7” x 1.1” (17.8 mm x 27.
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MRF24J40MA Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 3 2.0 Circuit Description ........................................................................................................................................................................ 7 3.0 Regulatory Approval........................................................................
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MRF24J40MA 1.0 DEVICE OVERVIEW The MRF24J40MA is a 2.4 GHz IEEE Std. 802.15.4™ compliant, surface mount module with integrated crystal, internal voltage regulator, matching circuitry and PCB antenna. The MRF24J40MA module operates in the non-licensed 2.4 GHz frequency band and is FCC, IC and ETSI compliant. The integrated module design frees the integrator from extensive RF and antenna design, and regulatory compliance testing, allowing quicker time to market.
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MRF24J40MA TABLE 1-1: PIN DESCRIPTION Pin Symbol Type Description 1 GND Power 2 RESET DI Global hardware Reset pin 3 WAKE DI External wake-up trigger 4 INT DO Interrupt pin to microcontroller Ground 5 SDI DI Serial interface data input 6 SCK DI Serial interface clock 7 SDO DO Serial interface data output from MRF24J40 8 CS DI Serial interface enable 9 NC — No connection (allow pin to float; do not connect signal) 10 VIN Power Power supply 11 GND Ground Ground
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MRF24J40MA 1.2 Mounting Details The MRF24J40MA is a surface mountable module. Module dimensions are shown in Figure 1-3. The module Printed Circuit Board (PCB) is 0.032" thick with castellated mounting points on the edge. Figure 1-4 is a recommended host PCB footprint for the MRF24J40MA. FIGURE 1-4: RECOMMENDED PCB FOOTPRINT The MRF24J40MA has an integrated PCB antenna. For the best performance, follow the mounting details shown in Figure 1-5.
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MRF24J40MA FIGURE 1-5: MOUNTING DETAILS Keep area around antenna (approximately 1.2 inches) clear of metallic structures for best performance 1.2” Edge of PCB 1.2” 0.470” 0.4” 0.4” 0.4” PCB Ground Plane (Counterpoise) Extend as far as possible to the sides and below the module (at least 0.4 inches on each side) for best performance DS70329B-page 6 © 2008 Microchip Technology Inc.
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MRF24J40MA 2.0 CIRCUIT DESCRIPTION 2.1 The MRF24J40MA is a complete 2.4 GHz IEEE Std. 802.15.4™ compliant surface mount module with integrated crystal, internal voltage regulator, matching circuitry and PCB antenna. The MRF24J40MA module interfaces to many popular Microchip PIC microcontrollers via a 4-wire serial SPI interface, interrupt, wake, Reset, power and ground. Data communications with the MRF24J40MA module are documented in the “MRF24J40 IEEE 802.15.4™ 2.
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Advance Information C17 1.0 pF Note: PCB Antenna C16 NP NP = Not Placed. L4 6.8 nH C12 0.1 μF C15 0.5 pF C13 47 pF C6 47 pF C10 47 pF C11 0.1 μF L1 8.2 nH L2 3.3 nH VIN VIN C2 1.0 pF L3 5.6 nH C14 0.5 pF C7 0.01 μF VIN VIN C8 1 μF VIN VIN 1 2 3 4 5 6 7 8 9 10 C9 100 pF X1 R1 NP VDD RFP RFN VDD VDD GND GPIO0 GPIO1 GPIO5 GPIO4 40 39 38 NC 37 36 35 34 33 32 31 VIN 3 WAKE 2 RESET 4 INT 5 SDI 6 SCK 30 NC 29 NC 28 NC 27 NC 26 25 24 23 NC 22 21 C18 18 pF 20.
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MRF24J40MA TABLE 2-1: MRJ24J40MA BILL OF MATERIALS Designator Description Manufacturer Part Number C1 Chip Capacitor 0402 X5R 1U Murata GRM155R60J105ME19D C2 Chip Capacitor 0402 COG 1.
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MRF24J40MA 2.2 FIGURE 2-5: Printed Circuit Board The MRF24J40MA module printed circuit board is constructed with FR4 material, four layers and 0.032 inches thick. The layers are shown in Figure 2-2 through Figure 2-6. The stack up of the PCB is shown in Figure 2-7. FIGURE 2-2: TOP SILK SCREEN Note: Top view negative Gerber. FIGURE 2-6: FIGURE 2-3: Note: BOTTOM COPPER TOP COPPER Note: FIGURE 2-4: LAYER 3 – POWER PLANE Top view. LAYER 2 – GROUND PLANE Top view negative Gerber.
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MRF24J40MA FIGURE 2-7: PCB LAYER STACK UP 1/2 oz. Copper Top Copper 8 mil FR4 1/2 oz. Copper Ground Plane 0.032” 12 mil FR4 +/- 0.005” 1/2 oz. Copper Power Plane 8 mil FR4 1/2 oz. Copper © 2008 Microchip Technology Inc.
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MRF24J40MA 2.3 FIGURE 2-8: PCB Antenna The PCB antenna is fabricated on the top copper trace. Figure 2-8 shows the trace dimensions. The layers below the antenna have no copper traces. The ground and power planes under the components serve as a counterpoise to the PCB antenna. Additional ground plane on the host PCB will substantially enhance the performance of the module. For best performance, place the module on the host PCB following the recommendations in Section 1.2 “Mounting Details”. 16.5 mm 4.
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MRF24J40MA FIGURE 2-10: SIMULATED 2D RADIATION PATTERN FIGURE 2-11: SIMULATED 3D RADIATION PATTERN dB (Gain Total) 2.0921e+000 1.1359e-001 -1.8649e+000 -3.8435e+000 -5.8220e+000 -7.8005e+000 -9.7791e+000 -1.1758e-001 -1.3736e+001 -1.5715e+001 -1.7693e+001 -1.9672e+001 -2.1650e+001 -2.3629e-001 -2.5607e+001 -2.7586e+001 -2.9564e+001 © 2008 Microchip Technology Inc.
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MRF24J40MA FIGURE 2-12: SIMULATED PCB ANTENNA IMPEDANCE FIGURE 2-13: MEASURED PCB ANTENNA IMPEDANCE DS70329B-page 14 Advance Information © 2008 Microchip Technology Inc.
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MRF24J40MA 3.0 REGULATORY APPROVAL The MRF24J40MA module has received regulatory approvals for modular devices in the United States, Canada and European countries. Modular approval allows the end user to place the MRF24J40MA module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter), provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the equipment.
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MRF24J40MA The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of FCC RF Exposure compliance: To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended.
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MRF24J40MA 3.3 Europe The MRF24J40MA module has been certified for use in European countries. The following testing has been completed: The end user is responsible for ensuring compliance with harmonized frequencies and labeling requirements for each country the end device is marketed and sold. Test standard ETSI EN 300 328 V1.7.1 (2006-10): 3.3.1 • • • • Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.
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MRF24J40MA 4.0 ELECTRICAL CHARACTERISTICS TABLE 4-1: RECOMMENDED OPERATING CONDITIONS Parameters Min Typ Max Units Ambient Operating Temperature -40 — +85 °C Supply Voltage for RF, Analog and Digital Circuits 2.4 — 3.6 V Supply Voltage for Digital I/O 2.4 3.3 3.6 V Input High Voltage (VIH) 0.5 x VDD — VDD + 0.3 V Input Low Voltage (VIL) -0.3 — 0.2 x VDD V TABLE 4-2: CURRENT CONSUMPTION (TA = 25°C, VDD = 3.
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MRF24J40MA TABLE 4-4: TRANSMITTER AC CHARACTERISTICS Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz Parameters Min Typ Max RF Carrier Frequency 2.405 — 2.480 GHz Maximum RF Output Power — 0 — dBm RF Output Power Control Range — 36 — dB — 1.25 — dB Carrier Suppression — -30 — dBc TX Spectrum Mask for Offset Frequency > 3.
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MRF24J40MA APPENDIX A: REVISION HISTORY Revision A (June 2008) Original data sheet for the MRF24J40MA device. Revision B (November 2008) Changed C17 to 1.0 pF and removed CLKOUT signal. © 2008 Microchip Technology Inc.
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MRF24J40MA INDEX A O AC Characteristics Receiver ......................................................................19 Transmitter .................................................................. 20 Antenna Impedance Measured PCB ............................................................ 14 Simulated PCB ............................................................ 14 Overview ...............................................................................
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MRF24J40MA THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers.
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MRF24J40MA READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
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MRF24J40MA PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. M X T -X Device Module Module Type Tape and Reel Temperature Range Device MRF24J40MA; VDD range 2.4V to 3.6V Temperature Range I = -40°C to © 2008 Microchip Technology Inc. +85°C Examples: a) b) MRF24J40MA-I = Industrial temp. tray MRF24J40MAT-I = Industrial temp., tape and reel.
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