Datasheet

June 2009 11 M0371-061809
Micrel, Inc. MIC5219
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20 40 60 80 100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
a. 25°C Ambient b. 50°C Ambient c. 85°C Ambient
Figure 4. MIC5219-x.xBMM (MSOP-8) on 1-inch
2
Copper Cladding
a. 25°C Ambient b. 50°C Ambient c. 85°C Ambient
Figure 3. MIC5219-x.xBMM (MSOP-8) on Minimum Recommended Footprint
a. 25°C Ambient b. 50°C Ambient c. 85°C Ambient
Figure 2. MIC5219-x.xBM5 (SOT-23-5) on 1-inch
2
Copper Cladding
a. 25°C Ambient b. 50°C Ambient c. 85°C Ambient
Figure 1. MIC5219-x.xBM5 (SOT-23-5) on Minimum Recommended Footprint