Datasheet
2013 Microchip Technology Inc. DS22329A-page 3
MCP87018
Diode Characteristics
Diode Forward Voltage V
FD
—0.8 1 VI
S
= 25A, V
GS
= 0V
Reverse Recovery Charge Q
RR
—47—nCI
S
= 25A, di/dt = 300 A/µs
Reverse Recovery Time t
rr
—28—nsI
S
= 25A, di/dt = 300 A/µs
Avalanche Characteristics
Avalanche Energy E
AS
200 — — mJ I
D
= 20A, L = 1 mH, R
G
= 25
TEMPERATURE CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, T
A
= +25°C
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Junction Temperature Range T
J
-55 — 150 °C
Storage Temperature Range T
A
-55 — 150 °C
Package Thermal Resistances
Thermal Resistance Junction-to-X, 8L 5x6-PDFN R
θJX
——56°C/WNote 1
Thermal Resistance Junction-to-Case, 8L 5x6-PDFN R
θJC
——1.4°C/WNote 2
Note 1: R
θJX
is determined with the device surface mounted on a 4-Layer FR4 PCB, with a 1" x 1" mounting pad of
2 oz. copper. This characteristic is dependent on user’s board design.
2: R
θJC
is determined using JEDEC 51-14 Method. This characteristic is determined by design.
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, T
A
= +25°C
Parameters Sym. Min. Typ. Max. Units Conditions