Datasheet

MCP73871 EVALUATION BOARD

USER’S GUIDE

Appendix B. Bill Of Materials (BOM)

TABLE B-1: BILL OF MATERIALS (BOM)

Qty Reference Description Manufacturer Part Number

4 Bump BUMPON HEMISPHERE 0.44 X 0.20

WHITE

3M SJ5003-9-ND

3 C1, C2, C3 CAP CERAMIC 4.7 μF 10 X5R 0603 Taiyo Yuden

LMK107BJ475KA-T

1 LED1 True Green Water Clear 0603 SMD

LED

Para Light USA L-C191LGCT-U1

1 LED2 Super Red Water Clear 0603 SMD

LED

Para Light USA L-C191KRCT-U1

1 LED3 Blue Water Clear 0603 SMD LED Para Light USA L-C191LBCT-U1

1 PCB Printed Circuit Board Microchip Technology Inc. 104-00183-R1

4 R1, R3, R4, R5 RES 1K OHM 1/10W 1% 0603 SMD Panasonic

- ECG ERJ-3EKF1001V

2 R2, R6 RES 10K OHM 1/10W 1% 0603 SMD Panasonic - ECG ERJ-3EKF1002V

2 SW1, SW2 SWITCH SLIDE SPDT SMD J-LEAD Copal Electronics Inc CJS-1200TA

6 TP1, TP2, TP3,

TP4, TP5, TP6

PC Test Point Compact SMT Keystone Electronics

5016

1 U1 Stand-Alone System Load Sharing

and Li-Ion / Li-Polymer Battery Charge

Management Controller; 4.2V Charge

Voltage Regulation Option

Microchip Technology, Inc MCP73871-2CCI/ML

Note: The components listed in this Bill of Materials are representative of the PCB assembly. The

released BOM used in manufacturing uses all RoHS-compliant components.