Datasheet

© 2011 Microchip Technology Inc. DS25007B-page 47
MCP6V26/7/8
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP6V26 Single Op Amp
MCP6V26T Single Op Amp (Tape and Reel)
MCP6V27 Dual Op Amp
MCP6V27T Dual Op Amp (Tape and Reel)
MCP6V28 Single Op Amp with Chip Select
MCP6V28T Single Op Amp with Chip Select
(Tape and Reel)
Temperature Range: E = -40°C to +125°C
Package: MD = Plastic Dual Flat, No-Lead (4×4x0.9), 8-lead
MNY * = Plastic Dual Flat, No-Lead (2×3x0.75), 8-lead
MS = Plastic Micro Small Outline Package, 8-lead
SN = Plastic SOIC (150mil Body), 8-lead
* Y = Nickel Palladium gold manufacturing designator. Only
available on the TDFN package.
PART NO. –X /XX
PackageTemperature
Range
Device
Examples:
a) MCP6V26T-E/MNY: Extended temperature,
8LD 2×3 TDFN
package
b) MCP6V26-E/MS: Extended temperature,
8LD MSOP package
a) MCP6V26T-E/SN: Tape and Reel,
Extended temperature,
8LD SOIC package
a) MCP6V27-E/MD: Extended temperature,
8LD 4x4 DFN package
b) MCP6V27-E/MS: Extended temperature,
8LD MSOP package
c) MCP6V27-E/SN: Extended temperature,
8LD SOIC package
a) MCP6V28T-E/MNY: Extended temperature,
8LD 2×3 TDFN
package
b) MCP6V28-E/MS: Extended temperature,
8LD MSOP package
c) MCP6V28T-E/SN: Tape and Reel,
Extended temperature,
8LD SOIC package