Datasheet

© 2008 Microchip Technology Inc. DS22093B-page 39
MCP6V06/7/8
APPENDIX A: REVISION HISTORY
Revision B (December 2008)
The following is the list of modifications:
1. Added the 8-lead, 2x3 TDFN package for the
MCP6V01 and MCP6V03 devices.
2. Added 8-lead, 2x3 TDFN package information to
Thermal Characteristic table.
3. Added information on the Exposed Thermal Pad
(EP) for the 8-lead, 2x3 TDFN and 8-lead, 4x4
DFN packages.
4. Added Section 4.3.6 “Stabilizing Output
Loads”.
5. Other minor typographical corrections.
Revision A (June 2008)
• Original Release of this Document.