Datasheet

 2003-2012 Microchip Technology Inc. DS21117B-page 39
MCP6S21/2/6/8
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PART NO. -X /XX
PackageTemperature
Range
Device
Device: MCP6S21: One Channel PGA
MCP6S21T: One Channel PGA
(Tape and Reel for SOIC and MSOP)
MCP6S22: Two Channel PGA
MCP6S22T: Two Channel PGA
(Tape and Reel for SOIC and MSOP)
MCP6S26: Six Channel PGA
MCP6S26T: Six Channel PGA
(Tape and Reel for SOIC and TSSOP)
MCP6S28: Eight Channel PGA
MCP6S28T: Eight Channel PGA
(Tape and Reel for SOIC)
Temperature Range: I = -40°C to +85°C
Package: MS = Plastic Micro Small Outline (MSOP), 8-lead
P = Plastic DIP (300 mil Body), 8, 14, and 16-lead
SN = Plastic SOIC, (150 mil Body), 8-lead
SL = Plastic SOIC (150 mil Body), 14, 16-lead
ST = Plastic TSSOP (4.4mm Body), 14-lead
Examples:
a) MCP6S21-I/P: One Channel PGA,
PDIP package.
b) MCP6S21-I/SN: One Channel PGA,
SOIC package.
c) MCP6S21-I/MS: One Channel PGA,
MSOP package.
d) MCP6S22-I/MS: Two Channel PGA,
MSOP package.
e) MCP6S22T-I/MS: Tape and Reel,
Two Channel PGA, MSOP package.
f) MCP6S26-I/P: Six Channel PGA,
PDIP package.
g) MCP6S26-I/SN: Six Channel PGA,
SOIC package.
h) MCP6S26T-I/ST: Tape and Reel,
Six Channel PGA, TSSOP package.
i) MCP6S28T-I/SL: Tape and Reel,
Eight Channel PGA, SOIC package.