Datasheet

MCP6S21/2/6/8

DS21117B-page 36  2003-2012 Microchip Technology Inc.

14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

840840



Foot Angle

10501050



Mold Draft Angle Bottom

10501050



Mold Draft Angle Top

0.300.250.19.012.010.007B1Lead Width

0.200.150.09.008.006.004

Lead Thickness

0.700.600.50.028.024.020LFoot Length

5.105.004.90.201.197.193DMolded Package Length

4.504.404.30.177.173.169E1Molded Package Width

6.506.386.25.256.251.246EOverall Width

0.150.100.05.006.004.002A1Standoff §

0.950.900.85.037.035.033A2Molded Package Thickness

1.10.043AOverall Height

0.65.026

Pitch

1414

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERS*INCHESUnits







A2A1

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.005” (0.127mm) per side.

JEDEC Equivalent: MO-153

Drawing No. C04-087

§ Significant Characteristic

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging