Datasheet

 2003-2012 Microchip Technology Inc. DS21117B-page 5
MCP6S21/2/6/8
TEMPERATURE CHARACTERISTICS
FIGURE 1-1: Channel Select Timing
Diagram.
FIGURE 1-2: PGA Shutdown timing
diagram (must enter correct commands before
CS
goes high).
FIGURE 1-3: Gain Select Timing
Diagram.
FIGURE 1-4: POR power-up and power-
down timing diagram.
Electrical Specifications: Unless otherwise indicated, V
DD
= +2.5V to +5.5V, V
SS
= GND.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range T
A
-40 — +85 °C
Operating Temperature Range T
A
-40 — +125 °C (Note 1)
Storage Temperature Range T
A
-65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 8L-PDIP 
JA
—85—°C/W
Thermal Resistance, 8L-SOIC 
JA
—163—°C/W
Thermal Resistance, 8L-MSOP 
JA
—206—°C/W
Thermal Resistance, 14L-PDIP 
JA
—70—°C/W
Thermal Resistance, 14L-SOIC 
JA
—120—°C/W
Thermal Resistance, 14L-TSSOP 
JA
—100—°C/W
Thermal Resistance, 16L-PDIP 
JA
—70—°C/W
Thermal Resistance, 16L-SOIC 
JA
—90—°C/W
Note 1: The MCP6S21/2/6/8 family of PGAs operates over this extended temperature range, but with reduced
performance. Operation in this range must not cause T
J
to exceed the Maximum Junction Temperature
(150°C).
CS
V
OUT
t
CH
0.6V
0.3V
CS
t
OFF
V
OUT
t
ON
Hi-Z Hi-Z
I
SS
500 nA (typ)
1.0 mA (typ)
0.3V
CS
V
OUT
t
G
1.5V
0.3V
V
DD
t
RPD
V
OUT
t
RPU
Hi-Z Hi-Z
V
POR
- 0.1V V
POR
- 0.1V
V
POR
+ 0.1V
0.3V
I
SS
500 nA (typ)
1.0 mA (typ)