Datasheet

MCP6S21/2/6/8
DS21117B-page 38  2003-2012 Microchip Technology Inc.
16-Lead Plastic Small Outline (SL) – Narrow 150 mil (SOIC)
Foot Angle

048048
1512015120

Mold Draft Angle Bottom
1512015120

Mold Draft Angle Top
0.510.420.33.020.017.013BLead Width
0.250.230.20.010.009.008
c
Lead Thickness
1.270.840.41.050.033.016LFoot Length
0.510.380.25.020.015.010hChamfer Distance
10.019.919.80.394.390.386DOverall Length
3.993.903.81.157.154.150E1Molded Package Width
6.206.025.79.244.237.228EOverall Width
0.250.180.10.010.007.004A1Standoff §
1.551.441.32.061.057.052A2Molded Package Thickness
1.751.551.35.069.061.053AOverall Height
1.27.050
p
Pitch
1616
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units

A2
E1
1
2
L
h
n
B
45
E
p
D


c
A1
A
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-108
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging