MCP6L1/1R/2/4 2.8 MHz, 200 µA Op Amps Features Description • • • • • • • The Microchip Technology Inc. MCP6L1/1R/2/4 family of operational amplifiers (op amps) supports generalpurpose applications. Battery powered circuits benefit from their low quiescent current, A/D converters from their wide bandwidth and anti-aliasing filters from their low input bias current. Supply Voltage: 2.7V to 6.0V Rail-to-Rail Output Input Range Includes Ground Available in SOT-23-5 Package Gain Bandwidth Product: 2.
MCP6L1/1R/2/4 NOTES: DS22135C-page 2 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings † VDD – VSS .......................................................................7.0V Current at Input Pins ....................................................±2 mA Analog Inputs (VIN+, VIN-) †† ........ VSS – 1.0V to VDD + 1.0V All Inputs and Outputs ................... VSS – 0.3V to VDD + 0.3V Difference Input voltage ...................................... |VDD – VSS| Output Short Circuit Current .............................
MCP6L1/1R/2/4 TABLE 1-2: AC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = 25°C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 60 pF (refer to Figure 1-1). Parameters Sym Min Typ Max Units Conditions GBWP — 2.8 — MHz Phase Margin PM — 50 — Slew Rate SR — 2.3 — Input Noise Voltage Eni — 7 — µVP-P Input Noise Voltage Density eni — 21 — nV/Hz f = 10 kHz Input Noise Current Density ini — 0.
MCP6L1/1R/2/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
MCP6L1/1R/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2, RL = 10 kto VL and CL = 60 pF. 1.E-02 10m 1m 1.E-03 100µ 1.E-04 10µ 1.E-05 1µ 1.E-06 100n 1.E-07 10n 1.E-08 1n 1.E-09 100p 1.E-10 10p 1.E-11 1p 1.E-12 Input, Output Voltages (V) Input Current Magnitude (A) 6 +125°C +85°C +25°C -40°C 3 2 1 0 0.E+00 5.E-06 100 -30 250 80 -60 40 Gain -90 -120 20 -150 0 -180 -20 0.1 1 10 1.E- 1.E+ 1.E+ 01 00 01 FIGURE 2-8: Frequency.
MCP6L1/1R/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2, RL = 10 kto VL and CL = 60 pF. 3.0 VDD – VOH IOUT 60 2.5 Slew Rate (V/µs) Ratio of Output Headroom to Output Current (mV/mA) 70 50 40 VOL – VSS -IOUT 30 20 1m 1.E-03 Output Current Magnitude (A) -50 10m 1.E-02 FIGURE 2-13: Ratio of Output Voltage Headroom to Output Current vs. Output Current. FIGURE 2-16: Temperature. 10 P-P ) G = +1 V/V Output Voltage Swing (V 2.
MCP6L1/1R/2/4 NOTES: DS22135C-page 8 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP6L1 MCP6L1R MCP6L2 MCP6L4 SOT-23-5 SOIC-8, MSOP-8 SOT-23-5 SOIC-8, MSOP-8 SOIC-14, TSSOP-14 Symbol 1 4 3 5 — — — — — — 2 — — — — 6 2 3 7 — — — — — — 4 — — — 1, 5, 8 1 4 3 2 — — — — — — 5 — — — — 1 2 3 8 5 6 7 — — — 4 — — — — 1 2 3 4 5 6 7 8 9 10 11 12 13 14 — VOUT, VOUTA VIN-, VINAVIN+, VINA+ VDD VINB+ VINBVOUTB VOUTC VINCVINC+ VSS VIND+ VINDVOUTD NC 3.
MCP6L1/1R/2/4 NOTES: DS22135C-page 10 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 4.0 APPLICATION INFORMATION The MCP6L1/1R/2/4 family of op amps is manufactured using Microchip’s state of the art CMOS process. They are unity gain stable and suitable for a wide range of general purpose applications. 4.1 Inputs 4.1.1 PHASE REVERSAL The MCP6L1/1R/2/4 op amps are designed to prevent phase inversion when the input pins exceed the supply voltages. Figure 2-10 shows an input voltage exceeding both supplies without any phase reversal. 4.1.2 4.1.
MCP6L1/1R/2/4 4.4 Supply Bypass 1. Inverting Amplifiers (Figure 4-5) and Transimpedance Gain Amplifiers (convert current to voltage, such as photo detectors). a) Connect the guard ring to the non-inverting input pin (VIN+); this biases the guard ring to the same reference voltage as the op amp’s input (e.g., VDD/2 or ground). b) Connect the inverting pin (VIN-) to the input with a wire that does not touch the PCB surface. Non-Inverting Gain and Unity Gain Buffer.
MCP6L1/1R/2/4 5.0 DESIGN AIDS Microchip provides the basic design aids needed for the MCP6L1/1R/2/4 family of op amps. 5.1 SPICE Macro Model The latest SPICE macro model for the MCP6L1/1R/2/4 op amp is available on the Microchip web site at www.microchip.com. The model was written and tested in official Orcad (Cadence) owned PSPICE. For other simulators, translation may be required. The model covers a wide aspect of the op amp’s electrical specifications.
MCP6L1/1R/2/4 NOTES: DS22135C-page 14 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Example: 5-Lead SOT-23 (MCP6L1, MCP6L1R) Device Code MCP6L1 WCNN MCP6L1R WDNN Note: Applies to 5-Lead SOT-23. 8-Lead MSOP (MCP6L1, MCP6L2) WC25 Example: 6L2E 14526 8-Lead SOIC (150 mil)(MCP6L1, MCP6L2) NNN Legend: XX...
MCP6L1/1R/2/4 Package Marking Information (Continued) 14-Lead SOIC (150 mil) (MCP6L4) Example: MCP6L4 E/SL 3 1145256 14-Lead TSSOP (MCP6L4) Example: XXXXXXXX YYWW NNN 6L4E Legend: XX...X Y YY WW NNN Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free.
MCP6L1/1R/2/4 0 $ !$ % $ 1 $$ ,44/// 4 " / !2 1 ! ! $ 3 1 & $ $ " $ b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 5 $! ! 6 $! 7% : & 3 ! 6 66 # # 7 7 9 ) " 3 $ 8%$! " 6 78 ) * + " 3 $ 8- ; $ " " 3 1 1 !! $ " && 8- @ "$ " " 3 1 @ "$ 8- 6 $ * + = ? = )
MCP6L1/1R/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22135C-page 18 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22135C-page 20 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22135C-page 22 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 !" #$% & ' () 0 $ !$ % $ 1 $$ ,44/// 4 DS22135C-page 24 " / !2 1 ! ! $ 3 1 & $ $ " $ 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22135C-page 26 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 0 $ !$ % $ 1 $$ ,44/// 4 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22135C-page 28 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22135C-page 30 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 APPENDIX A: REVISION HISTORY Revision C (January 2012) The following is the list of modifications: 1. 2. 3. Corrected CMRR value condition in Table 1-1. Updated packages temperature values in Table 1-3. Corrected values in first paragraph of Section 4.1.3 “Normal Operation”. Revision B (September 2011) The following is the list of modifications: 1. 2. 3. Updated Section 3.0 “Pin Descriptions”. Updated the value for the Current at Output and Supply Pins parameter in Section 1.
MCP6L1/1R/2/4 NOTES: DS22135C-page 32 2009-2012 Microchip Technology Inc.
MCP6L1/1R/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
MCP6L1/1R/2/4 NOTES: DS22135C-page 34 2009-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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