Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsLinear ICsLinear IC - Op-amp Multi-purpose TSSOP 14

 2012 Microchip Technology Inc. DS25138B-page 1

MCP6H91/2/4

Features:

• Input Offset Voltage: ±1 mV (typical)

• Quiescent Current: 2mA (typical)

• Common Mode Rejection Ratio: 98 dB (typical)

• Power Supply Rejection Ratio: 94 dB (typical)

• Rail-to-Rail Output

• Supply Voltage Range:

- Single-Supply Operation: 3.5V to 12V

- Dual-Supply Operation: ±1.75V to ±6V

• Gain Bandwidth Product: 10 MHz (typical)

• Slew Rate: 10 V/µs (typical)

• Unity Gain Stable

• Extended Temperature Range: -40°C to +125°C

• No Phase Reversal

Applications:

• Automotive Power Electronics

• Industrial Control Equipment

• Battery Powered Systems

• Medical Diagnostic Instruments

Design Aids:

• SPICE Macro Models

•FilterLab

Software

• MAPS (Microchip Advanced Part Selector)

• Analog Demonstration and Evaluation Boards

• Application Notes

Typical Application

Description:

Microchip’s MCP6H91/2/4 family of operational

amplifiers (op amps) has a wide supply voltage range

of 3.5V to 12V and rail-to-rail output operation. This

family is unity gain stable and has a gain bandwidth

product of 10 MHz (typical). These devices operate

with a single-supply voltage as high as 12V, while only

drawing 2 mA/amplifier (typical) of quiescent current.

The MCP6H91/2/4 family is offered in single

(MCP6H91), dual (MCP6H92) and quad (MCP6H94)

configurations. All devices are fully specified in

extended temperature range from -40°C to +125°C.

Package Types

Difference Amplifier

OUT

REF

MCP6H91

* Includes Exposed Thermal Pad (EP); see Table 3-1.

OUT

–

OUTB

INB

–

INB

INA

–

OUTA

INA

–

OUTA

OUTB

INB

–

INB

–

OUT

MCP6H91

SOIC

MCP6H92

SOIC

MCP6H91

2x3 TDFN

MCP6H92

2x3 TDFN

MCP6H94

SOIC, TSSOP

INA

–

OUTA

OUTD

IND

–

IND

INB

INC

INB

–

OUTB

7 8

OUTC

INC

–

10 MHz, 12V Op Amps

Summary of content (42 pages)

PAGE 1
MCP6H91/2/4 10 MHz, 12V Op Amps Features: Description: • • • • • • Microchip’s MCP6H91/2/4 family of operational amplifiers (op amps) has a wide supply voltage range of 3.5V to 12V and rail-to-rail output operation. This family is unity gain stable and has a gain bandwidth product of 10 MHz (typical). These devices operate with a single-supply voltage as high as 12V, while only drawing 2 mA/amplifier (typical) of quiescent current.
PAGE 2
MCP6H91/2/4 NOTES: DS25138B-page 2  2012 Microchip Technology Inc.
PAGE 3
MCP6H91/2/4 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings † † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. †† See Section 4.1.
PAGE 4
MCP6H91/2/4 DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VDD = +3.5V to +12V, VSS = GND, TA = +25°C, VCM = VDD/2 - 1.4V, VOUT  VDD/2, VL = VDD/2 and RL = 10 kto VL. (Refer to Figure 1-1). Parameters Sym. Min. Typ. Max. Units Conditions VOH 3.490 3.495 — V VDD = 3.5V 0.5V input overdrive 4.985 4.993 — V VDD = 5V 0.5V input overdrive 11.970 11.980 — V VDD = 12V 0.5V input overdrive — 0.005 0.010 V VDD = 3.5V 0.
PAGE 5
MCP6H91/2/4 TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, VDD = +3.5V to +12V and VSS = GND. Parameters Sym. Min. Typ. Max. Units Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 8L-2x3 TDFN JA — 52.5 — °C/W Thermal Resistance, 8L-SOIC JA — 149.5 — °C/W Thermal Resistance, 14L-SOIC JA — 95.
PAGE 6
MCP6H91/2/4 NOTES: DS25138B-page 6  2012 Microchip Technology Inc.
PAGE 7
MCP6H91/2/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
PAGE 8
MCP6H91/2/4 0 -100 -200 -300 -400 -500 -600 -700 -800 -900 -1000 110 TA = +125°C TA = +85°C TA = +25°C TA = -40°C Representative Part 0 1 2 80 70 PSRR- 60 50 40 Representative Part 20 10 10 3 4 5 6 7 8 9 10 11 12 Power Supply Voltage (V) 100 100 100k 1000000 1M 100000 CMRR, PSRR vs. 130 CMRR, PSRR (dB) 120 100 10 PSRR 110 100 90 80 CMRR @ VDD = 12V @ VDD = 5V @ VDD = 3.5V 70 60 50 40 1 1 10 FIGURE 2-8: vs. Frequency.
PAGE 9
MCP6H91/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +3.5V to +12V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT  VDD/2, VL = VDD/2, RL = 10 kto VL and CL = 60 pF. Open Loop Gain (dB) Input Bias Current (A) TA = +125°C 10000 10n 1000 1n 100 100p TA = +85°C 10 10p VDD = 12 V 100 1 1p 2 4 6 8 10 Common Mode Input Voltage (V) FIGURE 2-13: Input Bias Current vs. Common Mode Input Voltage. -90 40 -120 20 -150 0 -180 2.5 2.4 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 1.5 1 -210 1.0E+01 1.0E+02 1.
PAGE 10
MCP6H91/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +3.5V to +12V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT  VDD/2, VL = VDD/2, RL = 10 kto VL and CL = 60 pF. 70 Output Short Circuit Current (mA) Channel to Channel Separation (dB) 130 120 110 100 90 80 Input Referred 60 50 40 30 10 70 1k 10k 100k Frequency (Hz) 14 180 12 160 Gain Bandwidth Product 140 10 120 8 100 Phase Margin 80 60 4 40 2 20 VDD = 3.
PAGE 11
MCP6H91/2/4 1000 VDD = 5V 100 10 VDD - VOH 1 VSS - VOL 0.1 0.01 VDD = 3.5V 100 VSS - VOL VDD - VOH 0.1 0.01 0.1 1 Output Current (mA) VDD - VOH 5 4 VOL - VSS VDD = 5V 3 2 -25 0 25 50 75 Ambient Temperature (°C) 100 125 FIGURE 2-28: Output Voltage Headroom vs. Ambient Temperature. 10 FIGURE 2-26: Output Voltage Headroom vs. Output Current. 10 9 8 7 6 5 VDD - VOH 4 VDD = 3.
PAGE 12
MCP6H91/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +3.5 V to +12 V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT  VDD/2, VL = VDD/2, RL = 10 kto VL and CL = 60 pF. 9 25 Falling Edge, VDD = 5V Rising Edge, VDD = 5V 8 15 10 5 7 Output Voltage (V) Slew Rate (V/μs) 20 Falling Edge, VDD = 3.5V Rising Edge, VDD = 3.5V 6 5 4 3 VDD = 12 V G = +1 V/V 2 1 0 -50 -25 0 25 50 75 Ambient Temperature (°C) FIGURE 2-31: Temperature. 100 0 125 Slew Rate vs.
PAGE 13
MCP6H91/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +3.5 V to +12 V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT  VDD/2, VL = VDD/2, RL = 10 kto VL and CL = 60 pF. 1m 1.00E-03 100 100μ 1.00E-05 1μ 1.00E-06 -IIN (A) Closed Loop Output Impedance (:) 1.00E-04 10μ 10 100n 1.00E-07 10n 1.00E-08 GN: 101 V/V 11 V/V 1 V/V 1n TA = +125°C TA = +85°C TA = +25°C TA = -40°C 1.00E-09 100p 1.00E-10 10p 1.00E-11 1 1.0E+01 100 1.0E+02 1k 1.0E+03 1.0E+04 10k 100k Frequency (Hz) 1.
PAGE 14
MCP6H91/2/4 NOTES: DS25138B-page 14  2012 Microchip Technology Inc.
PAGE 15
MCP6H91/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1.
PAGE 16
MCP6H91/2/4 NOTES: DS25138B-page 16  2012 Microchip Technology Inc.
PAGE 17
MCP6H91/2/4 4.0 APPLICATION INFORMATION The MCP6H91/2/4 family of op amps is manufactured using Microchip’s state-of-the-art CMOS process and is specifically designed for low-power, high-precision applications. 4.1 VDD D1 D2 V1 VOUT Inputs 4.1.1 MCP6H9X V2 PHASE REVERSAL The MCP6H91/2/4 op amps are designed to prevent phase reversal when the input pins exceed the supply voltages. Figure 2-36 shows the input voltage exceeding the supply voltage without any phase reversal. 4.1.
PAGE 18
MCP6H91/2/4 4.2 Rail-to-Rail Output 4.3 Capacitive Loads Driving large capacitive loads can cause stability problems for voltage feedback op amps. As the load capacitance increases, the feedback loop’s phase margin decreases and the closed-loop bandwidth is reduced. This produces gain peaking in the frequency response, with overshoot and ringing in the step response. While a unity-gain buffer (G = +1V/V) is the most sensitive to capacitive loads, all gains show the same general behavior.
PAGE 19
MCP6H91/2/4 4.6 PCB Surface Leakage 4.7 In applications where low input bias current is critical, PCB surface leakage effects need to be considered. Surface leakage is caused by humidity, dust or other contamination on the board. Under low-humidity conditions, a typical resistance between nearby traces is 1012. A 15V difference would cause 15 pA of current to flow; which is greater than the MCP6H91/2/4 family’s bias current at +25°C (10 pA, typical).
PAGE 20
MCP6H91/2/4 4.7.2 ACTIVE FULL-WAVE RECTIFIER The MCP6H91/2/4 family of amplifiers can be used in applications such as an active full-wave rectifier, as shown in Figure 4-9. The amplifier and feedback loops in this active voltage rectifier circuit eliminate the diode drop problem that exists in a passive voltage rectifier. This circuit behaves as a voltage follower (the output follows the input) as long as the input signal is more positive than the reference voltage.
PAGE 21
MCP6H91/2/4 5.0 DESIGN AIDS Microchip Technology Inc. provides the basic design tools needed for the MCP6H91/2/4 family of op amps. 5.1 SPICE Macro Model The latest SPICE macro model for the MCP6H91/2/4 op amp is available on the Microchip web site at www.microchip.com. The model was written and tested in PSpice, owned by Orcad (Cadence®). For other simulators, translation may be required. The model covers a wide aspect of the op amp’s electrical specifications.
PAGE 22
MCP6H91/2/4 NOTES: DS25138B-page 22  2012 Microchip Technology Inc.
PAGE 23
MCP6H91/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead SOIC (150 mil.) (MCP6H91, MCP6H92) Example: MCP6H91E 3 SN e^^1223 256 Example: 8-Lead 2x3 TDFN (MCP6H91, MCP6H92) Part Number Code MCP6H91T-E/MNY ABG MCP6H92T-E/MNY ABH 14-Lead SOIC (150 mil) (MCP6H94) ABG 123 25 Example: MCP6H94 E/SL 1223256 14-Lead TSSOP (MCP6H94) XXXXXXXX YYWW NNN Legend: XX...
PAGE 24
MCP6H91/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS25138B-page 24  2012 Microchip Technology Inc.
PAGE 25
MCP6H91/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012 Microchip Technology Inc.
PAGE 26
MCP6H91/2/4 ' ! " # $%& ! " # $ % & "' " " ( $ ) % *++&&& ! !+ $ DS25138B-page 26  2012 Microchip Technology Inc.
PAGE 27
MCP6H91/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012 Microchip Technology Inc.
PAGE 28
MCP6H91/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS25138B-page 28  2012 Microchip Technology Inc.
PAGE 29
MCP6H91/2/4 ' * + , - . 01 1 23 ! " #4*+ & ! " # $ % & "' " " ( $ ) % *++&&& ! !+ $  2012 Microchip Technology Inc.
PAGE 30
MCP6H91/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS25138B-page 30  2012 Microchip Technology Inc.
PAGE 31
MCP6H91/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012 Microchip Technology Inc.
PAGE 32
MCP6H91/2/4 ' ! " # $ % & "' " " ( $ ) % *++&&& ! !+ $ DS25138B-page 32  2012 Microchip Technology Inc.
PAGE 33
MCP6H91/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012 Microchip Technology Inc.
PAGE 34
MCP6H91/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS25138B-page 34  2012 Microchip Technology Inc.
PAGE 35
MCP6H91/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012 Microchip Technology Inc.
PAGE 36
MCP6H91/2/4 NOTES: DS25138B-page 36  2012 Microchip Technology Inc.
PAGE 37
MCP6H91/2/4 APPENDIX A: REVISION HISTORY Revision B (December 2012) The following is the list of modifications: • Updated the VDD – VSS value in the Absolute Maximum Ratings † section. Revision A (June 2012) • Original Release of this Document.  2012 Microchip Technology Inc.
PAGE 38
MCP6H91/2/4 NOTES: DS25138B-page 38  2012 Microchip Technology Inc.
PAGE 39
MCP6H91/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
PAGE 40
MCP6H91/2/4 NOTES: DS25138B-page 40  2012 Microchip Technology Inc.
PAGE 41
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 42
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