Datasheet

© 2006 Microchip Technology Inc. DS22004B-page 5
MCP6G01/1R/1U/2/3/4
FIGURE 1-1: Gain Select Timing Diagram.
GSEL High to Valid Output Time,
G = +10 to +50 Select
t
GSH10 —
12
—µs
V
IN
= 30 mV,
GSEL = 0.75V
DD
to V
OUT
= 1.38V
GSEL Low to Valid Output Time,
G = +50 to +10 Select
t
GSL50 —
9
—µs
V
IN
= 30 mV,
GSEL = 0.25V
DD
to V
OUT
= 0.42V
DIGITAL ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, T
A
= 25°C, V
DD
= +1.8V to +5.5V, V
SS
= GND, G = +1 V/V, V
IN
= (0.3V)/G,
R
L
= 100 kΩ to V
DD
/2, C
L
= 60 pF, GSEL = V
DD
/2, and CS is tied low.
Parameters Sym Min Typ Max Units Conditions
Note 1: GSEL is a tri-level input pin. The gain is 10 when its voltage is low, 1 when it is at mid-suppy, and 50 when it is high.
2: Not tested in production. Set by design and characterization.
3: I
SS_SHDN
includes the current through the CS pin, R
L
and R
LAD
, and excludes digital switching currents. The block dia-
gram on the from page shows these current paths (through V
SS
).
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V
DD
= +1.8V to +5.5V, and V
SS
= GND.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range T
A
–40 — +125 °C
Operating Temperature Range T
A
–40 — +125 °C (Note 1)
Storage Temperature Range T
A
–65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SOT-23 θ
JA
— 256 — °C/W
Thermal Resistance, 8L-SOIC θ
JA
— 163 — °C/W
Thermal Resistance, 8L-MSOP θ
JA
— 206 — °C/W
Thermal Resistance, 14L-SOIC θ
JA
— 120 — °C/W
Thermal Resistance, 14L-TSSOP θ
JA
— 100 — °C/W
Note 1: The MCP6G01/1R/1U/2/3/4 family of SGAs operates over this temperature range, but operation must not cause T
J
to
exceed Maximum Junction Temperature (+150°C).
GSEL
V
OUT
t
GSL1
0.15V
1.50V
V
IN
0.150V
0.030V
0.15V
t
GSM10
0.03V
1.50V
t
GSH1
0.03V
t
GSM50
0.30V
1.50V
t
GSH10
0.30V
t
GSL50