Datasheet

© 2006 Microchip Technology Inc. DS22004B-page 31
MCP6G01/1R/1U/2/3/4
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
L
β
c
φ
2
1
D
n
B
p
E1
E
α
A2A1
A
8°4°0°8°4°
0°
φ
Foot Angle
β
Mold Draft Angle Bottom
12° REF
α
Mold Draft Angle Top
0.300.250.19.012.010.007BLead Width
0.200.150.09.008.006.004
c
Lead Thickness
0.700.600.50.028.024.020LFoot Length
5.105.004.90.201.197.193DMolded Package Length
4.504.404.30.177.173.169E1Molded Package Width
6.506.386.25.256.251.246EOverall Width
0.150.100.05.006.004.002A1Standoff
0.950.900.85.037.035.033A2Molded Package Thickness
1.101.051.00.043.041.039AOverall Height
0.65 BSC.026 BSC
p
Pitch
1414
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERS
* INCHESUnits
Dimensions D and E1 do not include mold fla sh or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
Notes:
JEDEC Equivalent: MO-153 AB-1
Revised: 08-17-05
* Controlling Parameter
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tole rance, for information purposes only.
See ASME Y14.5M
See ASME Y14.5M
Drawing No. C04-087
12° REF
12° REF
12° REF