Datasheet

 2009-2012 Microchip Technology Inc. DS22194D-page 65
MCP660/1/2/3/4/5/9
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. -X /XX
PackageTemperature
Range
Device
Device: MCP660 Triple Op Amp
MCP660T Triple Op Amp (Tape and Reel)
(SOIC, TSSOP, QFN)
MCP661 Single Op Amp
MCP661T Single Op Amp (Tape and Reel)
(SOIC SOT-23 and TDFN)
MCP662 Dual Op Amp
MCP662T Dual Op Amp (Tape and Reel)
(DFN, MSOP and SOIC)
MCP663 Single Op Amp with CS
MCP663T Single Op Amp with CS (Tape and Reel)
(SOIC and SOT-23)
MCP664 Quad Op Amp
MCP664T Quad Op Amp (Tape and Reel)
(SOIC, TSSOP)
MCP665 Dual Op Amp with CS
MCP665T Dual Op Amp with CS (Tape and Reel)
(DFN and MSOP)
MCP669 Quad Op Amp with CS
MCP669T Quad Op Amp with CS (Tape and Reel)
(QFN)
Temperature Range: E = -40°C to +125°C
Package: CHY = Plastic Small Outline (SOT-23), 6-lead
MF = Plastic Dual Flat, No Lead (3×3 DFN),
8-lead, 10-lead
ML = Plastic Quad Flat, No Lead Package (4x4 QFN),
(4x4x0.9 mm), 16-lead
MNY= Plastic Dual Flat, No Lead (2x3 TDFN),
8-lead
MS = Plastic Micro Small Outline (MSOP), 8-lead
OT = Plastic Small Outline (SOT-23), 5-lead
SL = Plastic Small Outline, Narrow, (3.90 mm SOIC),
14-lead
SN = Plastic Small Outline (3.90 mm), 8-lead
ST = Plastic Thin Shrink Small Outline, (4.4 mm TSSOP),
14-lead
UN = Plastic Micro Small Outline (MSOP), 10-lead
* Y = Nickel palladium gold manufacturing designator.
Only available on the TDFN package.
Examples:
a) MCP660T-E/ML: Tape and Reel
Extended temperature,
16LD QFN package
b) MCP660T-E/SN: Tape and Reel
Extended temperature,
14LD SOIC package
c) MCP660T-E/ST: Tape and Reel
Extended temperature,
14LD TSSOP package
d) MCP661T-E/SN: Tape and Reel
Extended temperature,
8LD SOIC package
e) MCP661T-E/MNY: Tape and Reel,
Extended Temperature
8LD TDFN package
f) MCP662T-E/MF: Tape and Reel
Extended temperature,
8LD DFN package
g) MCP662T-E/MS: Tape and Reel
Extended temperature,
8LD MSOP package
h) MCP662T-E/SN: Tape and Reel
Extended temperature,
8LD SOIC package
i) MCP663T-E/SN: Tape and Reel
Extended temperature,
8LD SOIC package
j) MCP663T-E/CHY: Tape and Reel,
Extended Temperature,
6LD SOT-23 package
k) MCP664T-E/SN: Tape and Reel
Extended temperature,
14LD SOIC package
l) MCP664T-E/ST: Tape and Reel
Extended temperature,
14LD TSSOP package
m) MCP665T-E/MF: Tape and Reel
Extended temperature,
10LD DFN package
n) MCP665T-E/UN: Tape and Reel
Extended temperature,
10LD MSOP package
o) MCP669T-E/ML: Tape and Reel
Extended temperature,
16LD QFN package