Datasheet

 2009-2012 Microchip Technology Inc. DS22194D-page 63
MCP660/1/2/3/4/5/9
APPENDIX A: REVISION HISTORY
Revision D (March 2012)
The following is the list of modifications:
Added the MSOP (8L) package for MCP662 and
all related information throughout the document.
Revision C (November 2011)
The following is the list of modifications:
1. Added the SOT-23 (5L) and TDFN (8L) package
option for MCP661 and SOT-23 (6L) package
options for MCP663 and the related information
throughout the document. Updated Package
Types drawing with pin designation for each
new package.
2. Updated Ta ble 1- 4 to show the temperature
specifications for new packages.
3. Updated Ta ble 3- 1 to show all the pin functions.
4. Updated Section 6.0 “Packaging Informa-
tion” with markings for the new additions.
Added the corresponding SOT-23 (5L and 6L)
and 2x3 TDFN (8L) package options and related
information.
5. Updated table description and examples in the
Product Identification System section.
Revision B (September 2011)
The following is the list of modifications:
1. Added the MCP660, MCP664 and MCP669
amplifiers to the product family and the related
information throughout the document.
2. Added the 4x4 QFN (16L) package option for
MCP660 and MCP669, SOIC and TSSOP (14L)
package options for MCP660 and MCP665 and
the related information throughout the
document. Updated Package Types drawing
with pin designation for each new package.
3. Updated Ta ble 1- 4 to show the temperature
specifications for new packages.
4. Updated Ta ble 3- 1 to show all the pin functions.
5. Updated Section 6.0 “Packaging Informa-
tion” with markings for the new additions.
Added the corresponding SOIC and TSSOP
(14L), and 4x4 QFN (16L) package options and
related information.
6. Updated table description and examples in
Product Identification System.
Revision A (July 2009)
Original release of this document.