Datasheet

MCP660/1/2/3/4/5/9

DS22194D-page 30  2009-2012 Microchip Technology Inc.

Package Marking Information (Continued)

10-Lead MSOP (MCP665) Example:

665EUN

210256

10-Lead DFN (3×3) (MCP665) Example

Device Code

MCP665 BAFD

Note: Applies to 10-Lead 3x3 DFN

BAFD

1210

256

NNN

8-Lead SOIC (150 mil) (MCP661, MCP662, MCP663)

Example

MCP661E

SN ^^1210

256

662E

210256

8-Lead MSOP (3x3 mm) (MCP662)

Example

Pin 1

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.