Datasheet

MCP660/1/2/3/4/5/9
DS22194D-page 2  2009-2012 Microchip Technology Inc.
Package Types
MCP661
SOIC
MCP662
MSOP, SOIC
V
IN
+
V
IN
-
V
SS
V
DD
V
OUT
1
2
3
4
8
7
6
5
NC
NCNC
V
INA
+
V
INA
-
V
SS
1
2
3
4
8
7
6
5
V
OUTA
V
DD
V
OUTB
V
INB
-
V
INB
+
MCP665
MSOP
V
INA
+
V
INA
-
V
SS
1
2
3
4
10
9
8
7
V
OUTA
V
DD
V
OUTB
V
INB
-
V
INB
+
CS
A
5 6
CSB
MCP662
3x3 DFN*
V
INA
+
V
INA
-
V
SS
V
OUTA
V
DD
V
OUTB
V
INB
-
V
INB
+
MCP665
3x3 DFN*
* Includes Exposed Thermal Pad (EP); see Table 3-1.
1
2
3
4
8
7
6
5
V
INA
+
V
INA
-
CS
A
V
OUTA
V
DD
V
OUTB
V
INB
-
CS
B
1
2
3
5
10
9
8
6
V
SS
V
INB
+
4
7
MCP663
SOIC
V
IN
+
V
IN
-
V
SS
V
DD
V
OUT
1
2
3
4
8
7
6
5
NC
CS
NC
MCP660
SOIC, TSSOP
NC
NC
V
DD
1
2
3
4
14
13
12
11
NC
V
OUTC
V
INC
-
V
INC
+
V
SS
V
INA
+
5
10
V
INB
+
V
INA
-
6
9
V
OUTA
7 8
V
OUTB
V
INB
-
2
MCP669
4x4 QFN*
V
DD
V
INB
+
V
INA
-
V
IND
+
V
SS
V
INB
-
V
INC
+
V
OUTB
CSBC
V
OUTC
V
INC
-
V
OUTA
CSAD V
OUTD
V
IND
-
V
INA
+
EP
16
1
15 14 13
3
4
12
11
10
9
5678
17
MCP664
SOIC, TSSOP
V
INA
+
V
INA
-
V
DD
1
2
3
4
14
13
12
11
V
OUTA
V
OUTD
V
IND
-
V
IND
+
V
SS
V
INB
+
5
10
V
INC
+
V
INB
-
6
9
V
OUTB
7 8
V
OUTC
V
INC
-
2
MCP660
4x4 QFN*
V
DD
V
INA
+
NC
V
INC
+
V
SS
V
INA
-
V
INB
+
V
OUTA
NC
V
OUTB
V
INB
-
NC NC V
OUTC
V
INC
-
NC
EP
16
1
15 14 13
3
4
12
11
10
9
5678
17
EP
9
EP
11
C
S
V
IN
+
V
OUT
V
SS
V
IN
-
MCP663
SOT-23-6
V
DD
1
2
3
4
5
6
V
IN
+
V
OUT
V
SS
V
IN
-
MCP661
SOT-23-5
V
DD
1
2
3
4
5
MCP661
2x3 TDFN *
V
IN
+
V
IN
–
V
SS
V
DD
V
OUT
1
2
3
4
8
7
6
5
NC
C
SNC
EP
9