Datasheet
2010-2011 Microchip Technology Inc. DS22269B-page 21
MCP65R41/6
4.0 APPLICATIONS INFORMATION
The MCP65R41/6 family of push-pull and open-drain
output comparators are fabricated on Microchip’s state-
of-the-art CMOS process. They are suitable for a wide
range of high-speed applications requiring low power
consumption.
4.1 Comparator Inputs
4.1.1 NORMAL OPERATION
The input stage of this family of devices uses three
differential input stages in parallel: one operates at low
input voltages, one at high input voltages, and one at
mid input voltages. With this topology, the input voltage
range is 0.3V above V
DD
and 0.3V below V
SS
, while
providing low offset voltage throughout the Common
mode range. The input offset voltage is measured at
both V
SS
- 0.3V and V
DD
+ 0.3V to ensure proper
operation.
The MCP65R41/6 family has internally-set hysteresis
V
HYST
that is small enough to maintain input offset
accuracy, and large enough to eliminate the output
chattering caused by the comparator’s own input noise
voltage E
NI
. Figure 4-1 depicts this behavior. Input
offset voltage (V
OS
) is the center (average) of the
(input-referred) low-high and high-low trip points. Input
hysteresis voltage (V
HYST
) is the difference between
the same trip points.
FIGURE 4-1: The MCP65R41/6
Comparators’ Internal Hysteresis Eliminates
Output Chatter Caused by Input Noise Voltage.
4.1.2 INPUT VOLTAGE AND CURRENT
LIMITS
The ESD protection on the inputs can be depicted as
shown in Figure 4-2. This structure was chosen to pro-
tect the input transistors, and to minimize the input bias
current (I
B
). The input ESD diodes clamp the inputs
when trying to go more than one diode drop below V
SS
.
They also clamp any voltages that go too far above
V
DD
; their breakdown voltage is high enough to allow a
normal operation, and low enough to bypass the ESD
events within the specified limits.
FIGURE 4-2: Simplified Analog Input ESD
Structures.
In order to prevent damage and/or improper operation
of these comparators, the circuit they are connected to
limit the currents (and voltages) at the V
IN
+ and V
IN
-
pins (see Absolute Maximum Ratings†). Figure 4-3
shows the recommended approach to protect these
inputs. The internal ESD diodes prevent the input pins
(V
IN
+ and V
IN
-) from going too far below ground, and
the resistors R
1
and R
2
limit the possible current drawn
out of the input pin. Diodes D
1
and D
2
prevent the input
pin (V
IN
+ and V
IN
-) from going too far above V
DD
.
When implemented as shown, resistors R
1
and R
2
also
limit the current through D
1
and D
2
.
-3
-2
-1
0
1
2
3
4
5
6
7
8
9
0 100 2 00 30 0 40 0 500 600 7 00 800 9 00 1000
Time (100 ms/div)
Output Voltage (V)
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
Input Voltage (10 mV/div)
V
OU
T
V
IN
-
Hysteresis
V
DD
= 5.0
V
Bond
Pad
Bond
Pad
Bond
Pad
V
DD
V
IN
+
V
SS
Input
Stage
Bond
Pad
V
IN
–