MCP6561/1R/1U/2/4 1.8V Low-Power Push-Pull Output Comparator Features Description • Propagation Delay at 1.8VDD: - 56 ns (typical) High-to-Low - 49 ns (typical) Low-to-High • Low Quiescent Current: 100 µA (typical) • Input Offset Voltage: ±3 mV (typical) • Rail-to-Rail Input: VSS - 0.3V to VDD + 0.3V • CMOS/TTL-Compatible Output • Wide Supply Voltage Range: 1.8V to 5.5V • Available in Single, Dual, and Quad • Packages: SC70-5, SOT-23-5, SOIC, MSOP, TSSOP The Microchip Technology, Inc.
MCP6561/1R/1U/2/4 NOTES: DS22139C-page 2 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 1.0 ELECTRICAL CHARACTERISTICS 1.1 Maximum Ratings † † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. VDD - VSS ...........................................
MCP6561/1R/1U/2/4 AC CHARACTERISTICS Electrical Characteristics: Unless otherwise indicated: VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN- = VSS, RL = 10 k to VDD/2, and CL = 25 pF. (see Figure 1-1). Parameters Symbol Min Typ Max Units Conditions High-to-Low,100 mV Overdrive tPHL — 56 80 ns VCM= VDD/2, VDD = 1.8V — 34 80 ns VCM= VDD/2, VDD = 5.5V Low-to-High, 100 mV Overdrive tPLH — 49 80 ns VCM= VDD/2, VDD = 1.8V — 47 80 ns VCM= VDD/2, VDD = 5.
MCP6561/1R/1U/2/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
MCP6561/1R/1U/2/4 Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD /2, VIN – = GND, RL = 10 k to VDD/2, and CL = 25 pF. 3.0 5.0 VCM = VSS 2.0 VCM = VSS VDD= 1.8V VHYST (mV) V OS (mV) 4.0 1.0 0.0 -1.0 3.0 VDD= 1.8V 2.0 VDD= 5.5V -2.0 VDD= 5.0V -3.0 1.0 -50 -25 0 FIGURE 2-7: Temperature. 25 50 75 Temperature (°C) 100 125 Input Offset Voltage vs. -50 -25 0 FIGURE 2-10: Temperature. 4.
MCP6561/1R/1U/2/4 Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD /2, VIN – = GND, RL = 10 k to VDD/2, and CL = 25 pF. 3.0 5.0 TA= +125°C 0.0 TA= +85°C 4.0 TA= -40°C TA= +25°C TA= +85°C TA= +125°C 1.0 VHYST (mV) VOS (mV) 2.0 -1.0 TA= +25°C 3.0 TA= -40°C 2.0 -2.0 -3.0 1.0 1.5 2.5 3.5 VDD (V) 4.5 5.5 1.5 FIGURE 2-13: Input Offset Voltage vs. Supply Voltage vs. Temperature. 4.5 5.5 140.0 VDD = 5.5V Avg.
MCP6561/1R/1U/2/4 Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD /2, VIN – = GND, RL = 10 k to VDD/2, and CL = 25 pF. 400 350 TA= -40°C TA= +25°C TA= +85°C TA= +125°C 80 300 VDD = 5.5V ISC (mA) IQ (µA) 120 0dB Output Attenuation 100 mV Over-Drive VCM = VDD /2 RL = Open 250 200 VDD = 1.8V 40 0 -40 TA= -40°C TA= +25°C TA= +85°C TA= +125°C 150 -80 100 -120 50 10 10 100 100 0.
MCP6561/1R/1U/2/4 Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD /2, VIN – = GND, RL = 10 k to VDD/2, and CL = 25 pF. 80 100 mV Over-Drive VCM = VDD /2 40% VDD = 1.8V Avg. = -7.3 ns StDev= 0.8 ns 198 units 30% VDD = 5.5V Avg. = 11.6 ns StDev= 2 ns 198 units 20% 100 mV Over-Drive VCM = VDD /2 70 Prop. Delay (ns) Occurrences (%) 50% 10% tPLH , VDD = 1.8V tPHL tPHL , VDD = 1.8V 60 50 40 tPLH , VDD = 5.5V tPHL , VDD = 5.
MCP6561/1R/1U/2/4 Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD /2, VIN – = GND, RL = 10 k to VDD/2, and CL = 25 pF. 1000 10 VDD = 5.5V, tPLH VDD = 5.5V, tPHL 1 0.1 20% 15% 10% 5% 0.01 0.001 1 0% 0.01 10 0.1 1 10 10 1000 100 1000 10000 100000 1E+06 Capacitive Load (nf) FIGURE 2-31: Capacitive Load. Propagation Delay vs. -600 -400 -200 FIGURE 2-34: Ratio (PSRR).
MCP6561/1R/1U/2/4 Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD /2, VIN – = GND, RL = 10 k to VDD/2, and CL = 25 pF. 10000 1000 VDD = 5.5V IB @ TA= VDD = 5.5V 1000 VIN+ = 2Vpp (sine) IOS and IB (pA) Output Jitter pk-pk (ns) 10000 100 10 1 IB @ TA= 100 10 1 |IOS| @ TA= 125°C 0.1 |IOS|@ TA= 85°C 0.01 0.001 0.1 100 100 1k 1000 10M 10k 100k 1M 10000 100000 1000000 1E+07 Input Frequency (Hz) FIGURE 2-37: Frequency. Output Jitter vs.
MCP6561/1R/1U/2/4 NOTES: DS22139C-page 12 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. TABLE 3-1: MCP6561 MCP6561U MCP6562 MCP6564 SOT-23-5 SOT-23-5 MSOP, SOIC SOIC, TSSOP 1 1 4 1 1 OUT, OUTA Digital Output (comparator A) 4 4 3 2 2 VIN–, VINA– Inverting Input (comparator A) 3 3 1 3 3 VIN+, VINA+ Non-inverting Input (comparator A) 5 2 5 8 4 VDD Non-inverting Input (comparator B) SC70-5, SOT-23-5 3.
MCP6561/1R/1U/2/4 NOTES: DS22139C-page 14 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 4.0 APPLICATIONS INFORMATION The MCP6561/1R/1U/2/4 family of push-pull output comparators are fabricated on Microchip’s state-of-theart CMOS process. They are suitable for a wide range of high speed applications requiring low power consumption. 4.1 VDD Bond Pad VIN+ Bond Pad Bond Pad Input Stage VIN– Comparator Inputs 4.1.
MCP6561/1R/1U/2/4 A significant amount of current can flow out of the inputs when the Common-mode voltage (VCM) is below ground (VSS); see Figure 2-32. Applications that are high impedance may need to limit the usable voltage range. 4.1.3 4.3.1 Figure 4-4 shows a non-inverting circuit for singlesupply applications using just two resistors. The resulting hysteresis diagram is shown in Figure 4-5. PHASE REVERSAL VDD The MCP6561/1R/1U/2/4 comparator family uses CMOS transistors at the input.
MCP6561/1R/1U/2/4 4.3.2 INVERTING CIRCUIT Where: Figure 4-6 shows an inverting circuit for single-supply using three resistors. The resulting hysteresis diagram is shown in Figure 4-7.
MCP6561/1R/1U/2/4 4.6 PCB Surface Leakage 4.7 In applications where low input bias current is critical, PCB (Printed Circuit Board) surface leakage effects need to be considered. Surface leakage is caused by humidity, dust or other contamination on the board. Under low humidity conditions, a typical resistance between nearby traces is 1012. A 5V difference would cause 5 pA of current to flow. This is greater than the MCP6561/1R/1U/2/4 family’s bias current at +25°C (1 pA, typical).
MCP6561/1R/1U/2/4 4.9 4.9.3 Typical Applications 4.9.1 PRECISE COMPARATOR Some applications require higher DC precision. An easy way to solve this problem is to use an amplifier (such as the MCP6291) to gain-up the input signal before it reaches the comparator. Figure 4-12 shows an example of this approach. BISTABLE MULTIVIBRATOR A simple bistable multivibrator design is shown in Figure 4-14. VREF needs to be between the power supplies (VSS = GND and VDD) to achieve oscillation.
MCP6561/1R/1U/2/4 NOTES: DS22139C-page 20 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 5.0 DESIGN AIDS 5.3 5.1 Microchip Advanced Part Selector (MAPS) The following Microchip Application Note is available on the Microchip web site at www.microchip.com and is recommended as a supplemental reference resource: MAPS is a software tool that helps semiconductor professionals efficiently identify Microchip devices that fit a particular design requirement. Available at no cost from the Microchip web site at www.microchip.
MCP6561/1R/1U/2/4 NOTES: DS22139C-page 22 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 5-Lead SC-70 (MCP6561) Example: BC25 XXNN 5-Lead SOT-23 (MCP6561, MCP6561R, MCP6561U) Device XXNN Example: Code MCP6561T WBNN MCP6561RT WANN MCP6561UT WKNN WA25 Note: Applies to 5-Lead SOT-23. 8-Lead MSOP (MCP6562) XXXXXX 6562E YWWNNN 302256 8-Lead SOIC (150 mil) (MCP6562) XXXXXXXX XXXXYYWW NNN Example: MCP6562E e3 SN^^1302 256 Legend: XX...
MCP6561/1R/1U/2/4 Package Marking Information (Continued) 14-Lead SOIC (150 mil) (MCP6564) Example: XXXXXXXXXX XXXXXXXXXX YYWWNNN 14-Lead TSSOP (MCP6564) MCP6564 E/SL^^ e3 1302256 Example: XXXXXXXX MCP6564E YYWW 1302 NNN 256 DS22139C-page 24 2009-2013 Microchip Technology Inc.
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MCP6561/1R/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22139C-page 28 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22139C-page 30 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22139C-page 32 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 " # $% !&' ( ) * . # # $ # / ! - 0 # 1 / % # # ! # ## +22--- 2 / DS22139C-page 34 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22139C-page 36 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 . # # $ # / ! - 0 # 1 / % # # ! # ## +22--- 2 / 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22139C-page 38 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22139C-page 40 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 APPENDIX A: REVISION HISTORY Revision C (February 2013) The following is the list of modifications: 1. 2. Added the Analog Input (VIN) parameter in Section 1.0 “Electrical Characteristics”. Updated the package drawing section. Revision B (August 2009) The following is the list of modifications: 1. 2. Added MCP6561U throughout the document. Updated package drawing section. Revision A (March 2009) • Original Release of this Document. 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 NOTES: DS22139C-page 42 2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
MCP6561/1R/1U/2/4 NOTES: DS22139B-page 44 2009-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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