Datasheet
MCP651/1S/2/3/4/5/9
DS22146C-page 2 2009-2011 Microchip Technology Inc.
Package Types
MCP651
SOIC
MCP652
SOIC
V
IN
+
V
IN
–
V
SS
V
DD
V
OUT
1
2
3
4
8
7
6
5
V
CAL
CAL/CS
NC
V
INA
+
V
INA
–
V
SS
1
2
3
4
8
7
6
5
V
OUTA
V
DD
V
OUTB
V
INB
–
V
INB
+
MCP655
MSOP
V
INA
+
V
INA
–
V
SS
1
2
3
4
10
9
8
7
V
OUTA
V
DD
V
OUTB
V
INB
–
V
INB
+
CAL
A/CSA
5 6
CALB/CSB
MCP652
3x3 DFN *
MCP655
3x3 DFN *
* Includes Exposed Thermal Pad (EP); see Table 3 - 1 .
V
INA
+
V
INA
–
V
SS
V
OUTB
V
INB
–
1
2
3
4
8
7
6
5
V
INB
+
V
DD
V
OUTA
EP
9
V
SS
V
INA
+
CAL
A/CSA
V
INB
–
V
INB
+
2
3
4
5
9
8
7
6
CALB/CSB
V
OUTB
V
INA
–
EP
11
1 10
V
DD
V
OUTA
2
MCP659
4x4 QFN*
V
DD
V
INB
+
V
INA
-
V
IND
+
V
SS
V
INB
-
V
INC
+
V
OUTB
CALBC/CSBC
V
OUTC
V
INC
-
V
OUTA
CALAD/CSAD
V
OUTD
V
IND
-
V
INA
+
EP
16
1
15 14 13
3
4
12
11
10
9
5678
17
MCP654
SOIC, TSSOP
V
INA
+
V
INA
-
V
DD
1
2
3
4
14
13
12
11
V
OUTA
V
OUTD
V
IND
-
V
IND
+
V
SS
V
INB
+
5
10
V
INC
+
V
INB
-
6
9
V
OUTB
7 8
V
OUTC
V
INC
-
1
2
3
4
V
OUT
V
DD
V
SS
V
IN
+
V
IN
–
5
1
2
3
4
V
OUT
V
DD
V
SS
V
IN
+
V
IN
–
5
6
CAL/
CS
MCP651S
SOT-23-5
MCP653
SOT-23-6
MCP651
2x3 TDFN *
V
IN
+
V
IN
–
V
SS
V
DD
V
OUT
1
2
3
4
8
7
6
5
V
CAL
CAL/
CS
NC
EP
9