Datasheet
Table Of Contents
- Package Types
- Typical Application
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- Figure 2-1: Input Offset Voltage
- Figure 2-2: Input Offset Voltage Drift
- Figure 2-3: Input Offset Voltage vs. Common Mode Input Voltage
- Figure 2-4: Input Offset Voltage vs. Common Mode Input Voltage
- Figure 2-5: Input Offset Voltage vs. Output Voltage
- Figure 2-6: Input Offset Voltage vs. Power Supply Voltage
- FIGURE 2-7: Input Noise Voltage Density vs. Frequency.
- FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage.
- FIGURE 2-9: CMRR, PSRR vs. Frequency.
- FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature.
- FIGURE 2-11: Input Bias, Offset Currents vs. Ambient Temperature.
- FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage.
- FIGURE 2-13: Quiescent Current vs. Ambient Temperature.
- FIGURE 2-14: Quiescent Current vs. Common Mode Input Voltage.
- FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage.
- FIGURE 2-16: Quiescent Current vs. Power Supply Voltage.
- FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency.
- FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature.
- FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.
- FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.
- FIGURE 2-21: Output Short Circuit Current vs. Power Supply Voltage.
- FIGURE 2-22: Output Voltage Swing vs. Frequency.
- FIGURE 2-23: Output Voltage Headroom vs. Output Current.
- FIGURE 2-24: Output Voltage Headroom vs. Output Current.
- FIGURE 2-25: Output Voltage Headroom vs. Ambient Temperature.
- FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature.
- FIGURE 2-27: Slew Rate vs. Ambient Temperature.
- FIGURE 2-28: Small Signal Non-Inverting Pulse Response.
- FIGURE 2-29: Small Signal Inverting Pulse Response.
- FIGURE 2-30: Large Signal Non-Inverting Pulse Response.
- FIGURE 2-31: Large Signal Inverting Pulse Response.
- FIGURE 2-32: The MCP6491/2/4 Shows No Phase Reversal.
- FIGURE 2-33: Closed Loop Output Impedance vs. Frequency.
- FIGURE 2-34: Measured Input Current vs. Input Voltage (below VSS).
- FIGURE 2-35: Channel-to-Channel Separation vs. Frequency (MCP6492/4 only).
- 3.0 Pin Descriptions
- 4.0 Application Information
- 5.0 Design Aids
- 6.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Trademarks
- Worldwide Sales and Service

2012-2013 Microchip Technology Inc. DS20002321C-page 47
MCP6491/2/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP6491T: Single Op Amp (Tape and Reel)
(SC70, SOT-23)
MCP6492: Dual Op Amp (SOIC and MSOP only)
MCP6492T: Dual Op Amp (Tape and Reel)
(SOIC, MSOP and 2x3 TDFN)
MCP6494: Quad Op Amp
MCP6494T: Quad Op Amp (Tape and Reel)
(SOIC and TSSOP)
Temperature Range: E = -40°C to +125°C (Extended)
Package: LTY = Plastic Package (SC70), 5-lead
OT = Plastic Small Outline Transistor, (SOT-23),
5-lead
MNY* = Plastic Dual Flat, No Lead, (2x3 TDFN),
8-lead (TDFN)
SN = Lead Plastic Small Outline (150 mil body),
8-lead (SOIC)
MS = Plastic MSOP, 8-lead
SL = Plastic Small Outline, (150 mil body),
14-lead (SOIC)
ST = Plastic Thin Shrink Small Outline
(150 mil body), 14-lead (TSSOP)
* Y = Nickel palladium gold manufacturing designator. Only
available on the TDFN package.
PART NO. /XX
PackageTemperature
Range
Device
Examples:
a) MCP6491T-E/LTY: Tape and Reel,
Extended Temp.,
5LD SC70 package
b) MCP6491T-E/OT: Tape and Reel,
Extended Temp.,
5LD SOT-23 package
c) MCP6492-E/MS: Extended Temp.,
8LD MSOP package
d) MCP6492T-E/MS: Tape and Reel,
Extended Temp.,
8LD MSOP package
e) MCP6492-E/SN: Extended Temp.,
8LD SOIC package
f) MCP6492T-E/SN: Tape and Reel,
Extended Temp.,
8LD SOIC package
g) MCP6492T-E/MNY: Tape and Reel,
Extended Temp.,
8LD 2x3 TDFN package
h) MCP6494-E/SL: Extended Temp., 14LD
SOIC package
i) MCP6494T-E/SL: Tape and Reel,
Extended Temp., 14LD
SOIC package
j) MCP6494-E/ST: Extended Temp.,
14LD TSSOP package
k) MCP6494T-E/ST: Tape and Reel,
Extended Temp.,
14LD TSSOP package
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