Datasheet
Table Of Contents
- Package Types
- Typical Application
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- Figure 2-1: Input Offset Voltage
- Figure 2-2: Input Offset Voltage Drift
- Figure 2-3: Input Offset Voltage vs. Common Mode Input Voltage
- Figure 2-4: Input Offset Voltage vs. Common Mode Input Voltage
- Figure 2-5: Input Offset Voltage vs. Output Voltage
- Figure 2-6: Input Offset Voltage vs. Power Supply Voltage
- FIGURE 2-7: Input Noise Voltage Density vs. Frequency.
- FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage.
- FIGURE 2-9: CMRR, PSRR vs. Frequency.
- FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature.
- FIGURE 2-11: Input Bias, Offset Currents vs. Ambient Temperature.
- FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage.
- FIGURE 2-13: Quiescent Current vs. Ambient Temperature.
- FIGURE 2-14: Quiescent Current vs. Common Mode Input Voltage.
- FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage.
- FIGURE 2-16: Quiescent Current vs. Power Supply Voltage.
- FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency.
- FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature.
- FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.
- FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.
- FIGURE 2-21: Output Short Circuit Current vs. Power Supply Voltage.
- FIGURE 2-22: Output Voltage Swing vs. Frequency.
- FIGURE 2-23: Output Voltage Headroom vs. Output Current.
- FIGURE 2-24: Output Voltage Headroom vs. Output Current.
- FIGURE 2-25: Output Voltage Headroom vs. Ambient Temperature.
- FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature.
- FIGURE 2-27: Slew Rate vs. Ambient Temperature.
- FIGURE 2-28: Small Signal Non-Inverting Pulse Response.
- FIGURE 2-29: Small Signal Inverting Pulse Response.
- FIGURE 2-30: Large Signal Non-Inverting Pulse Response.
- FIGURE 2-31: Large Signal Inverting Pulse Response.
- FIGURE 2-32: The MCP6491/2/4 Shows No Phase Reversal.
- FIGURE 2-33: Closed Loop Output Impedance vs. Frequency.
- FIGURE 2-34: Measured Input Current vs. Input Voltage (below VSS).
- FIGURE 2-35: Channel-to-Channel Separation vs. Frequency (MCP6492/4 only).
- 3.0 Pin Descriptions
- 4.0 Application Information
- 5.0 Design Aids
- 6.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Trademarks
- Worldwide Sales and Service
2012-2013 Microchip Technology Inc. DS20002321C-page 45
MCP6491/2/4
APPENDIX A: REVISION HISTORY
Revision C (June 2013)
The following is the list of modifications:
1. Added new devices to the family (MCP6492 and
MCP6494) and related information throughout
the document.
2. Updated thermal package resistance
information in Table 1-3.
3. Added Figure 2-35 in Section 2.0, Typical Per-
formance Curves.
4. Updated Section 3.0, Pin Descriptions.
5. Added new Section 4.5, Unused Op Amps.
6. Updated the list of reference documents in
Section 5.5, Application Notes.
7. Added package markings and drawings for the
MCP6492 and MCP6494 devices.
8. Updated Product Identification System.
Revision B (October 2012)
The following is the list of modifications:
1. Updated the maximum low input offset voltage
value in the Features section.
2. Updated the minimum and maximum input
offset voltage in Table 1-1 “DC Electrical
Specifications”.
Revision A (September 2012)
• Original Release of this Document.