Datasheet
Table Of Contents
- Package Types
- Typical Application
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- Figure 2-1: Input Offset Voltage
- Figure 2-2: Input Offset Voltage Drift
- Figure 2-3: Input Offset Voltage vs. Common Mode Input Voltage
- Figure 2-4: Input Offset Voltage vs. Common Mode Input Voltage
- Figure 2-5: Input Offset Voltage vs. Output Voltage
- Figure 2-6: Input Offset Voltage vs. Power Supply Voltage
- FIGURE 2-7: Input Noise Voltage Density vs. Frequency.
- FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage.
- FIGURE 2-9: CMRR, PSRR vs. Frequency.
- FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature.
- FIGURE 2-11: Input Bias, Offset Currents vs. Ambient Temperature.
- FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage.
- FIGURE 2-13: Quiescent Current vs. Ambient Temperature.
- FIGURE 2-14: Quiescent Current vs. Common Mode Input Voltage.
- FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage.
- FIGURE 2-16: Quiescent Current vs. Power Supply Voltage.
- FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency.
- FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature.
- FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.
- FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.
- FIGURE 2-21: Output Short Circuit Current vs. Power Supply Voltage.
- FIGURE 2-22: Output Voltage Swing vs. Frequency.
- FIGURE 2-23: Output Voltage Headroom vs. Output Current.
- FIGURE 2-24: Output Voltage Headroom vs. Output Current.
- FIGURE 2-25: Output Voltage Headroom vs. Ambient Temperature.
- FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature.
- FIGURE 2-27: Slew Rate vs. Ambient Temperature.
- FIGURE 2-28: Small Signal Non-Inverting Pulse Response.
- FIGURE 2-29: Small Signal Inverting Pulse Response.
- FIGURE 2-30: Large Signal Non-Inverting Pulse Response.
- FIGURE 2-31: Large Signal Inverting Pulse Response.
- FIGURE 2-32: The MCP6491/2/4 Shows No Phase Reversal.
- FIGURE 2-33: Closed Loop Output Impedance vs. Frequency.
- FIGURE 2-34: Measured Input Current vs. Input Voltage (below VSS).
- FIGURE 2-35: Channel-to-Channel Separation vs. Frequency (MCP6492/4 only).
- 3.0 Pin Descriptions
- 4.0 Application Information
- 5.0 Design Aids
- 6.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Trademarks
- Worldwide Sales and Service
MCP6491/2/4
DS20002321C-page 4 2012-2013 Microchip Technology Inc.
Output
High-Level Output Voltage V
OH
2.380 2.396 — V V
DD
=2.4V
0.5V input overdrive
5.480 5.493 — V V
DD
=5.5V
0.5V input overdrive
Low-Level Output Voltage V
OL
— 0.004 0.020 V V
DD
=2.4V
0.5 V input overdrive
— 0.007 0.020 V V
DD
=5.5V
0.5 V input overdrive
Output Short-Circuit Current I
SC
—±15—mAV
DD
=2.4V
—±40—mAV
DD
=5.5V
Power Supply
Supply Voltage V
DD
2.4 — 5.5 V
Quiescent Current per Amplifier I
Q
200 530 800 µA I
O
=0, V
CM
=V
DD
/4
TABLE 1-2: AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, T
A
= +25°C, V
DD
= +2.4V to +5.5V, V
SS
= GND,
V
CM
=V
DD
/2, V
OUT
V
DD
/2, V
L
=V
DD
/2, R
L
=10kto V
L
and C
L
= 20 pF. (Refer to Figure 1-1).
Parameters Sym Min Typ Max Units Conditions
AC Response
Gain Bandwidth Product GBWP — 7.5 — MHz
Phase Margin PM — 57 — ° G = +1V/V
Slew Rate SR — 6 — V/µs
Noise
Input Noise Voltage E
ni
— 6 — µVp-p f = 0.1 Hz to 10 Hz
Input Noise Voltage Density e
ni
—19—nV/Hz f = 1 kHz
—14—nV/Hz f = 10 kHz
Input Noise Current Density i
ni
—0.6—fA/Hz f = 1 kHz
TABLE 1-1: DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, V
DD
= +2.4V to +5.5V, V
SS
= GND, T
A
= +25°C,
V
CM
=V
DD
/2, V
OUT
V
DD
/2, V
L
=V
DD
/2 and R
L
=10kto V
L
. (Refer to Figure 1-1).
Parameters Sym Min Typ Max Units Conditions
TABLE 1-3: TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, V
DD
= +2.4V to +5.5V and V
SS
= GND.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Operating Temperature Range T
A
-40 — +125 °C Note 1
Storage Temperature Range T
A
-65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SC-70
JA
— 331 — °C/W
Thermal Resistance, 5L-SOT-23
JA
— 256 — °C/W
Thermal Resistance, 8L-2x3 TDFN
JA
—52.5—°C/W
Thermal Resistance, 8L-MSOP
JA
—211—°C/W
Thermal Resistance, 8L-SOIC
JA
—149.5—°C/W
Thermal Resistance, 14L-SOIC
JA
—95.3—°C/W
Thermal Resistance, 14L-TSSOP
JA
— 100 — °C/W
Note 1: The internal junction temperature (T
J
) must not exceed the absolute maximum specification of +150°C.