Datasheet
Table Of Contents
- Package Types
- Typical Application
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- Figure 2-1: Input Offset Voltage
- Figure 2-2: Input Offset Voltage Drift
- Figure 2-3: Input Offset Voltage vs. Common Mode Input Voltage
- Figure 2-4: Input Offset Voltage vs. Common Mode Input Voltage
- Figure 2-5: Input Offset Voltage vs. Output Voltage
- Figure 2-6: Input Offset Voltage vs. Power Supply Voltage
- FIGURE 2-7: Input Noise Voltage Density vs. Frequency.
- FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage.
- FIGURE 2-9: CMRR, PSRR vs. Frequency.
- FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature.
- FIGURE 2-11: Input Bias, Offset Currents vs. Ambient Temperature.
- FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage.
- FIGURE 2-13: Quiescent Current vs. Ambient Temperature.
- FIGURE 2-14: Quiescent Current vs. Common Mode Input Voltage.
- FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage.
- FIGURE 2-16: Quiescent Current vs. Power Supply Voltage.
- FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency.
- FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature.
- FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.
- FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.
- FIGURE 2-21: Output Short Circuit Current vs. Power Supply Voltage.
- FIGURE 2-22: Output Voltage Swing vs. Frequency.
- FIGURE 2-23: Output Voltage Headroom vs. Output Current.
- FIGURE 2-24: Output Voltage Headroom vs. Output Current.
- FIGURE 2-25: Output Voltage Headroom vs. Ambient Temperature.
- FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature.
- FIGURE 2-27: Slew Rate vs. Ambient Temperature.
- FIGURE 2-28: Small Signal Non-Inverting Pulse Response.
- FIGURE 2-29: Small Signal Inverting Pulse Response.
- FIGURE 2-30: Large Signal Non-Inverting Pulse Response.
- FIGURE 2-31: Large Signal Inverting Pulse Response.
- FIGURE 2-32: The MCP6491/2/4 Shows No Phase Reversal.
- FIGURE 2-33: Closed Loop Output Impedance vs. Frequency.
- FIGURE 2-34: Measured Input Current vs. Input Voltage (below VSS).
- FIGURE 2-35: Channel-to-Channel Separation vs. Frequency (MCP6492/4 only).
- 3.0 Pin Descriptions
- 4.0 Application Information
- 5.0 Design Aids
- 6.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Trademarks
- Worldwide Sales and Service
2012-2013 Microchip Technology Inc. DS20002321C-page 11
MCP6491/2/4
Note: Unless otherwise indicated, T
A
=+25°C, V
DD
= +2.4V to +5.5V, V
SS
= GND, V
CM
=V
DD
/2, V
OUT
V
DD
/2,
V
L
=V
DD
/2, R
L
=10kto V
L
and C
L
=20pF.
FIGURE 2-25: Output Voltage Headroom
vs. Ambient Temperature.
FIGURE 2-26: Output Voltage Headroom
vs. Ambient Temperature.
FIGURE 2-27: Slew Rate vs. Ambient
Temperature.
FIGURE 2-28: Small Signal Non-Inverting
Pulse Response.
FIGURE 2-29: Small Signal Inverting Pulse
Response.
FIGURE 2-30: Large Signal Non-Inverting
Pulse Response.
3
4
5
6
7
Voltage Headroom (mV)
V
DD
-V
OH
V
OL
-V
SS
0
1
2
-50 -25 0 25 50 75 100 125
Output
Temperature (°C)
V
DD
= 2.4V
3
4
5
6
7
8
9
10
Voltage Headroom (mV)
V
DD
-V
OH
V
OL
-V
SS
0
1
2
3
-50 -25 0 25 50 75 100 125
Output
Temperature (°C)
V
DD
= 5.5V
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
-50 -25 0 25 50 75 100
125
Slew Rate (V/µs)
Ambient Temperature (°C)
Falling Edge, V
DD
= 5.5V
Rising Edge, V
DD
= 5.5V
Falling Edge, V
DD
= 2.4V
Rising Edge, V
DD
= 2.4V
Voltage (10 mV/div)Output
Time (0.2 µs/div)
V
DD
= 5 V
G = +1 V/V
Voltage (10 mV/div)
V
DD
= 5 V
G = -1 V/V
Output
Time (0.2 µs/div)
2.0
2.5
3.0
3.5
4.0
4.5
5.0
t
put Voltage (V)
V
5V
0.0
0.5
1.0
1.5
Ou
t
Time (1 µs/div)
V
DD
=
5V
G = +1 V/V