Datasheet

 2012-2013 Microchip Technology Inc. DS20002322C-page 45
MCP6481/2/4
APPENDIX A: REVISION HISTORY
Revision C (June 2013)
The following is the list of modifications:
1. Added new devices to the family (MCP6482 and
MCP6484) and related information throughout
the document.
2. Updated thermal package resistance
information in Table 1-3.
3. Added Figure 2-35 in Section 2.0, Typical Per-
formance Curves.
4. Updated Section 3.0, Pin Descriptions.
5. Added new Section 4.5, Unused Op Amps.
6. Updated the list of reference documents in
Section 5.5, Application Notes.
7. Added package markings and drawings for the
MCP6482 and MCP6484 devices.
8. Updated Product Identification System.
Revision B (October 2012)
The following is the list of modifications:
1. Updated the maximum low input offset voltage
value in the Section “Features”.
2. Updated the minimum and maximum input
offset voltage in Table 1-1 “DC Electrical
Specifications”.
3. Replaced FIGURE 2-1: “Input Offset
Voltage.”
Revision A (September 2012)
• Original Release of this Document.