Datasheet

 2012-2013 Microchip Technology Inc. DS20002322C-page 13
MCP6481/2/4
3.0 PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
3.1 Analog Outputs
The output pins are low-impedance voltage sources.
3.2 Analog Inputs
The non-inverting and inverting inputs are
high-impedance CMOS inputs with low bias currents.
3.3 Power Supply Pins
The positive power supply (V
DD
) is 2.2V to 5.5V higher
than the negative power supply (V
SS
). For normal
operation, the other pins are at voltages between V
SS
and V
DD
.
Typically, these parts are used in single-supply
operation. In this case, V
SS
is connected to ground and
V
DD
is connected to the supply. V
DD
will need bypass
capacitors.
3.4 Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the V
SS
pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (
JA
).
TABLE 3-1: PIN FUNCTION TABLE
MCP6481 MCP6482 MCP6484
Symbol Description
SC70, SOT-23 SOIC, MSOP 2x3 TDFN SOIC, TSSOP
1111V
OUT
, V
OUTA
Analog Output (op amp A)
4222V
IN
–, V
INA
– Inverting Input (op amp A)
3333V
IN
+, V
INA
+ Non-inverting Input (op amp A)
5884V
DD
Positive Power Supply
—555V
INB
+ Non-inverting Input (op amp B)
—666V
INB
– Inverting Input (op amp B)
—777V
OUTB
Analog Output (op amp B)
———8V
OUTC
Analog Output (op amp C)
———9V
INC
– Inverting Input (op amp C)
———10V
INC
+ Non-Inverting Input (op amp C)
24411V
SS
Negative Power Supply
———12V
IND
+ Non-Inverting Input (op amp D)
———13V
IND
– Inverting Input (op amp D)
———14V
OUTD
Analog Output (op amp D)
— — 9 — EP Exposed Thermal Pad (EP);
must be connected to V
SS
.