Datasheet

© 2010-2012 Microchip Technology Inc. DS22257C-page 41
MCP6441/2/4
APPENDIX A: REVISION HISTORY
Revision C (April 2012)
The following is the list of modifications:
1. Added new package type (8-Lead 2x3 TDFN)
for MCP6442, and the related information
throughout the document.
2. Updated Ta bl e 3-1 with TDFN package pinouts.
3. Updated Section 6.0, Packaging Information.
4. Updated the Product Identification SysteM
section.
Revision B (March 2011)
The following is the list of modifications:
1. Added the MCP6442 and MCP6444 package
information.
2. Updated the ESD protection value on all pins in
Section 1.1, Absolute Maximum Ratings †.
3. Added Figure 2-32.
4. Updated Ta bl e 3-1 .
5. Updated the package markings information and
drawings.
6. Updated the Product Identification SysteM
section.
Revision A (September 2010)
• Original Release of this Document.