Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsLinear ICsLinear IC - Op-amp Multi-purpose TDFN 8 (2x3)

MCP6441/2/4

Features:

• Low Quiescent Current: 450 nA (typical)

• Gain Bandwidth Product: 9 kHz (typical)

• Supply Voltage Range: 1.4V to 6.0V

• Rail-to-Rail Input and Output

• Unity Gain Stable

• Slew Rate: 3V/ms (typical)

• Extended Temperature Range: -40°C to +125°C

• No Phase Reversal

• Small Packages

Applications:

• Portable Equipment

• Battery Powered System

• Data Acquisition Equipment

• Sensor Conditioning

• Battery Current Sensing

• Analog Active Filters

Design Aids:

• SPICE Macro Models

•FilterLab

Software

• Microchip Advanced Part Selector (MAPS)

• Analog Demonstration and Evaluation Boards

• Application Notes

Description:

The MCP6441/2/4 device is a single nanopower

operational amplifier (op amp), which has low

quiescent current (450 nA, typical) and rail-to-rail input

and output operation. This op amp is unity gain stable

and has a gain bandwidth product of 9 kHz (typical).

These devices operate with a single supply voltage as

low as 1.4V. These features make the family of op

amps well suited for single-supply, battery-powered

applications.

The MCP6441/2/4 op amp is designed with Microchip’s

advanced CMOS process and offered in single

(MCP6441), dual (MCP6442), and quad (MCP6444)

configurations. All devices are available in the

extended temperature range, with a power supply

range of 1.4V to 6.0V.

Typical Application

Package Types

100 kΩ

1MΩ

1.4V

OUT

Battery Current Sensing

10Ω

6.0V

OUT

–

10 V/V()10

()

⋅

------------------------------------------=

To load

MCP6441

–

OUT

MCP6441

SC70-5, SOT-23-5

–

OUTA

MCP6442

SOIC, MSOP

MCP6444

SOIC, TSSOP

OUTB

INB

INA

–

IND+

OUTA

OUTC

INB

INA

–

INB

–

OUTB

INC

–

INC

IND

–

OUTD

MCP6442

2x3 TDFN *

–

OUTB

INB

–

INB

OUTA

* Includes Exposed Thermal Pad (EP); see Table 3-1.

450 nA, 9 kHz Op Amp

Summary of content (46 pages)

PAGE 1
MCP6441/2/4 450 nA, 9 kHz Op Amp Features: Description: • • • • • • • • • The MCP6441/2/4 device is a single nanopower operational amplifier (op amp), which has low quiescent current (450 nA, typical) and rail-to-rail input and output operation. This op amp is unity gain stable and has a gain bandwidth product of 9 kHz (typical). These devices operate with a single supply voltage as low as 1.4V. These features make the family of op amps well suited for single-supply, battery-powered applications.
PAGE 3
MCP6441/2/4 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings † Current at Output and Supply Pins ............................±30 mA † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied.
PAGE 4
MCP6441/2/4 AC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 1 MΩ to VL and CL = 60 pF. (Refer to Figure 1-1). Parameters Sym Min Typ Max Units kHz Conditions AC Response Gain Bandwidth Product GBWP — 9 — Phase Margin PM — 65 — ° Slew Rate SR — 3 — V/ms Input Noise Voltage Eni — 5 — µVp-p f = 0.
PAGE 5
MCP6441/2/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
PAGE 6
MCP6441/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 1 MΩ to VL and CL = 60 pF. CMRR,PSRR (dB) Input Noise Voltage Density (nV/ Hz) 1,000 100 0.1 0.1 11 10 100 10 100 Frequency (Hz) 10k 10000 Input Noise Voltage Density PSRR (VDD = 1.4V to 6.0V, VCM = VSS) CMRR (VDD = 6.0V, VCM = -0.3V to 6.3V) CMRR (VDD = 1.4V, VCM = -0.3V to 1.7V) -50 -25 100 125 CMRR, PSRR vs. Ambient 1000 350 300 250 VDD = 6.
PAGE 7
MCP6441/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 1 MΩ to VL and CL = 60 pF. 130 DC Open-Loop Gain (dB) 600 VDD = 6.0V 500 450 400 350 VDD = 1.4V 300 250 110 100 90 80 RL = 10 kΩ VSS + 0.1V < VOUT < VDD - 0.1V 70 FIGURE 2-13: Quiescent Current vs. Ambient Temperature. 6.0 5.5 5.0 4.5 4.0 3.5 125 3.0 0 25 50 75 100 Ambient Temperature (°C) 2.5 -25 1.0 -50 2.
PAGE 8
MCP6441/2/4 90 Phase Margin 16 80 14 70 12 60 10 50 Gain Bandwidth Product 8 40 6 30 4 20 VDD = 1.4V 2 10 0 -50 -25 Phase Margin (°) Gain Bandwidth Product (kHz) 18 0 25 50 75 100 Ambient Temperature (°C) 0 125 1000 10 RL = 10 kΩ 0.1 0.01 10 0.1 1 100 1000 Output Current (mA) 10 10000 FIGURE 2-22: Output Voltage Headroom vs. Output Current.
PAGE 9
MCP6441/2/4 VDD = 6.0V G = +1 V/V 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Output Voltage (V) Output Voltage (20 mv/div) Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 1 MΩ to VL and CL = 60 pF. Time (200 µs/div) FIGURE 2-25: Pulse Response. Small Signal Non-Inverting VDD = 6.0V G = -1 V/V Time (2 ms/div) FIGURE 2-28: Response. Large Signal Inverting Pulse VDD = 6.
PAGE 10
MCP6441/2/4 100µ 1.E-04 -IIN (A) 10µ 1.E-05 1µ 1.E-06 100n 1.E-07 10n 1.E-08 1n 1.E-09 100p 1.E-10 10p 1.E-11 TA = -40°C TA = +25°C TA = +85°C TA = +125°C 1p 1.E-12 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 Input Voltage (V) FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). DS22257C-page 10 n 150 o ti 140 a r a 130 p e S 120 l e ) 110 n n B a (d 100 h C 90 to l 80 e n n 70 a h 60 C (dB) 1m 1.
PAGE 11
MCP6441/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP6441 MCP6442 MCP6444 SC70-5, SOT-23-5 SOIC, MSOP 2x3 TDFN SOIC, TSSOP 1 1 1 1 3.
PAGE 13
MCP6441/2/4 4.0 APPLICATION INFORMATION The MCP6441/2/4 op amp is manufactured using Microchip’s state-of-the-art CMOS process, specifically designed for low power applications. 4.1 In some applications, it may be necessary to prevent excessive voltages from reaching the op amp inputs; Figure 4-2 shows one approach to protecting these inputs. VDD Rail-to-Rail Input 4.1.1 PHASE REVERSAL The MCP6441/2/4 op amp is designed to prevent phase reversal, when the input pins exceed the supply voltages.
PAGE 14
MCP6441/2/4 NORMAL OPERATION The input stage of the MCP6441/2/4 op amp uses two differential input stages in parallel. One operates at a low Common Mode input voltage (VCM), while the other operates at a high VCM. With this topology, the device operates with a VCM up to 300 mV above VDD and 300 mV below VSS. The input offset voltage is measured at VCM = VSS – 0.3V and VDD + 0.3V, to ensure proper operation. Figure 4-5 gives the recommended RISO values for the different capacitive loads and gains.
PAGE 15
MCP6441/2/4 The easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). The guard ring is biased at the same voltage as the sensitive pin. An example of this type of layout is shown in Figure 4-6. Guard Ring FIGURE 4-6: for Inverting Gain. 1. 2. VIN– VIN+ VSS Example Guard Ring Layout Non-inverting Gain and Unity-Gain Buffer: a) Connect the non-inverting pin (VIN+) to the input with a wire that does not touch the PCB surface.
PAGE 16
MCP6441/2/4 4.6.2 PRECISION HALF-WAVE RECTIFIER 4.6.3 The precision half-wave rectifier, which is also known as a super diode, is a configuration obtained with an operational amplifier in order to have a circuit behaving like an ideal diode and rectifier. It effectively cancels the forward voltage drop of the diode in such a way that very low level signals can still be rectified, with minimal error. This can be useful for high-precision signal processing.
PAGE 17
MCP6441/2/4 5.0 DESIGN AIDS Microchip provides the basic design tools needed for the MCP6441/2/4 op amp. 5.1 SPICE Macro Model The latest SPICE macro model for the MCP6441/2/4 op amp is available on the Microchip web site at www.microchip.com. The model was written and tested in the official OrCAD (Cadence®) owned PSpice®. For the other simulators, translation may be required. 5.
PAGE 19
MCP6441/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 5-Lead SC70 (MCP6441) Example: DG25 5-Lead SOT-23 (MCP6441) Example: XXNN WU25 8-Lead MSOP (MCP6442) Example: 6442E 211256 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free.
PAGE 20
MCP6441/2/4 8-Lead SOIC (150 mil) (MCP6442) Example: MCP6442E e3 1211 SN^^ 256 NNN 8-Lead TDFN (2x3x0.75 mm)(MCP6442) Example: AAX 211 25 14-Lead SOIC (150 mil) (MCP6444) Example: MCP6444 E/SL e^^3 1211256 14-Lead TSSOP (MCP6444) XXXXXXXX YYWW NNN Legend: XX...
PAGE 21
MCP6441/2/4 .
PAGE 22
MCP6441/2/4 5-Lead Plastic Small Outline Transistor (LT) [SC70] . # # $ # / ! - 0 # 1 / % # # ! # ## +22--- 2 / DS22257C-page 22 © 2010-2012 Microchip Technology Inc.
PAGE 23
MCP6441/2/4 ! .
PAGE 24
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22257C-page 24 © 2010-2012 Microchip Technology Inc.
PAGE 25
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010-2012 Microchip Technology Inc.
PAGE 26
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22257C-page 26 © 2010-2012 Microchip Technology Inc.
PAGE 27
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010-2012 Microchip Technology Inc.
PAGE 28
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22257C-page 28 © 2010-2012 Microchip Technology Inc.
PAGE 29
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010-2012 Microchip Technology Inc.
PAGE 30
MCP6441/2/4 " # $% !&' ( ) * . # # $ # / ! - 0 # 1 / % # # ! # ## +22--- 2 / DS22257C-page 30 © 2010-2012 Microchip Technology Inc.
PAGE 31
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010-2012 Microchip Technology Inc.
PAGE 32
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22257C-page 32 © 2010-2012 Microchip Technology Inc.
PAGE 33
MCP6441/2/4 " + , % - . / # 0!0 & ( ) +, . # # $ # / ! - 0 # 1 / % # # ! # ## +22--- 2 / © 2010-2012 Microchip Technology Inc.
PAGE 34
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22257C-page 34 © 2010-2012 Microchip Technology Inc.
PAGE 35
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010-2012 Microchip Technology Inc.
PAGE 36
MCP6441/2/4 . # # $ # / ! - 0 # 1 / % # # ! # ## +22--- 2 / DS22257C-page 36 © 2010-2012 Microchip Technology Inc.
PAGE 37
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010-2012 Microchip Technology Inc.
PAGE 38
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22257C-page 38 © 2010-2012 Microchip Technology Inc.
PAGE 39
MCP6441/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010-2012 Microchip Technology Inc.
PAGE 41
MCP6441/2/4 APPENDIX A: REVISION HISTORY Revision C (April 2012) The following is the list of modifications: 1. 2. 3. 4. Added new package type (8-Lead 2x3 TDFN) for MCP6442, and the related information throughout the document. Updated Table 3-1 with TDFN package pinouts. Updated Section 6.0, Packaging Information. Updated the Product Identification SysteM section. Revision B (March 2011) The following is the list of modifications: 1. 2. 3. 4. 5. 6. Added the MCP6442 and MCP6444 package information.
PAGE 43
MCP6441/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
PAGE 45
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 46
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