Datasheet

MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 2 © 2009-2011 Microchip Technology Inc.
E Temp Package Types H Temp Package Types
5
4
1
2
3
V
SS
V
IN
–
V
IN
+
V
DD
V
OUT
SOT-23-5
5
4
1
2
3
V
DD
V
IN
–
V
IN
+
V
SS
V
OUT
SC70-5, SOT-23-5
5
4
1
2
3
V
DD
V
OUT
V
IN
–
V
SS
V
IN
+
SOT-23-5
MCP6401 MCP6401R
MCP6401U
MCP6402
SOIC
V
INA
+
V
INA
–
V
SS
1
2
3
4
8
7
6
5
V
OUTA
V
DD
V
OUTB
V
INB
–
V
INB
+
MCP6404
V
INA
+
V
INA
–
V
SS
1
2
3
4
14
13
12
11
V
OUTA
V
DD
V
OUTD
V
IND
–
V
IND
+
10
9
8
5
6
7
V
OUTB
V
INB
–
V
INB
+
V
INC
+
V
INC
–
V
OUTC
SOIC, TSSOP
MCP6402
V
INA
+
V
INA
–
V
SS
V
INB
–
1
2
3
4
8
7
6
5
V
INB
+
V
OUTA
EP
9
V
DD
2x3 TDFN
V
OUTB
* Includes Exposed Thermal Pad (EP); see Table 3-1.
E temp: -40°C to +125°C
5
4
1
2
3
V
DD
V
IN
–V
IN
+
V
SS
V
OUT
SOT-23-5
MCP6401
MCP6402
SOIC
V
INA
+
V
INA
–
V
SS
1
2
3
4
8
7
6
5
V
OUTA
V
DD
V
OUTB
V
INB
–
V
INB
+
MCP6404
V
INA
+
V
INA
–
V
SS
1
2
3
4
14
13
12
11
V
OUTA
V
DD
V
OUTD
V
IND
–
V
IND
+
10
9
8
5
6
7
V
OUTB
V
INB
–
V
INB
+
V
INC
+
V
INC
–
V
OUTC
SOIC
5
4
1
2
3
V
DD
V
IN
–
V
IN
+
V
SS
V
OUT
SOT-23-5
MCP6406
MCP6407
SOIC
V
INA
+
V
INA
–
V
SS
1
2
3
4
8
7
6
5
V
OUTA
V
DD
V
OUTB
V
INB
–
V
INB
+
MCP6409
V
INA
+
V
INA
–
V
SS
1
2
3
4
14
13
12
11
V
OUTA
V
DD
V
OUTD
V
IND
–
V
IND
+
10
9
8
5
6
7
V
OUTB
V
INB
–
V
INB
+V
INC
+
V
INC
–
V
OUTC
SOIC
H temp: -40°C to +150°C