Datasheet

MCP631/2/3/4/5/9

DS22197B-page 28  2009-2011 Microchip Technology Inc.

Package Marking Information (Continued)

14-Lead SOIC (.150”) (MCP634)

Example

MCP634

E/SL ^^

1131256

10-Lead MSOP (MCP635)

Example:

635EUN

131256

10-Lead DFN (3x3) (MCP635)

Device Code

MCP635 BAFB

Note: Applies to 10-Lead 3x3 DFN

Example

BAFB

1131

256

8-Lead TDFN (2 x 3) (MCP631)

Example:

ABK

131

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.