Datasheet

 2009-2011 Microchip Technology Inc. DS22197B-page 57
MCP631/2/3/4/5/9
APPENDIX A: REVISION HISTORY
Revision B (November 2011)
The following is the list of modifications:
1. Added the MCP634 and MCP639 amplifiers to
the product family and the related information
throughout the document.
2. Added the 2x3 TDFN (8L), SOT23 (5L) package
option for MCP631, SOT23 (6L) package option
for MCP633, 4x4 QFN (16L) package option for
MCP639, SOIC and TSSOP (14L) package
options for MCP634 and the related information
throughout the document. Updated package
types drawing with pin designation for each new
package.
3. Updated Tabl e 1 - 4 to show the temperature
specifications for new packages.
4. Updated Ta bl e 3-1 to show all the pin functions.
5. Updated Section 6.0 “Packaging Informa-
tion” with markings for the new additions.
Added the corresponding SOT23 (5L), SOT23
(6L), TDFN (8L), SOIC, TSSOP (14L), and 4x4
QFN (16L) package options and related infor-
mation.
6. Updated table description and examples in the
Product Identification System section.
Revision A (August 2009)
• Original Release of this Document.