Datasheet

MCP631/2/3/4/5/9
DS22197B-page 2  2009-2011 Microchip Technology Inc.
Package Types
MCP631
SOIC
MCP632
SOIC
V
IN
+
V
IN
–
V
SS
V
DD
V
OUT
1
2
3
4
8
7
6
5
NC
NCNC
V
INA
+
V
INA
–
V
SS
1
2
3
4
8
7
6
5
V
OUTA
V
DD
V
OUTB
V
INB
-
V
INB
+
MCP635
MSOP
V
INA
+
V
INA
–
V
SS
1
2
3
4
10
9
8
7
V
OUTA
V
DD
V
OUTB
V
INB
-
V
INB
+
CS
A
5 6
CSB
MCP632
3x3 DFN *
V
INA
+
V
INA
–
V
SS
V
OUTA
V
DD
V
OUTB
V
INB
–
V
INB
+
MCP635
3x3 DFN *
* Includes Exposed Thermal Pad (EP); see Tabl e 3- 1.
1
2
3
4
8
7
6
5
V
INA
+
V
INA
–
CS
A
V
OUTA
V
DD
V
OUTB
V
INB
-
CS
B
1
2
3
5
10
9
8
6
V
SS
V
INB
+
4
7
MCP633
SOIC
V
IN
+
V
IN
–
V
SS
V
DD
V
OUT
1
2
3
4
8
7
6
5
NC
CS
NC
MCP634
SOIC, TSSOP
V
INA
+
V
INA
-
V
DD
1
2
3
4
14
13
12
11
V
OUTA
V
OUTD
V
IND
-
V
IND
+
V
SS
V
INB
+
5
10
V
INC
+
V
INB
-
6
9
V
OUTB
7 8
V
OUTC
V
INC
-
2
V
DD
V
INB
+
V
INA
-
V
IND
+
V
SS
V
INB
-
V
INC
+
V
OUTB
CSBC
V
OUTC
V
INC
-
V
OUTA
CSAD V
OUTD
V
IND
-
V
INA
+
EP
16
1
15 14 13
3
4
12
11
10
9
5678
17
MCP639
4x4 QFN*
EP
9
EP
11
MCP631
2x3 TDFN *
V
IN
+
V
IN
–
V
SS
V
DD
V
OUT
1
2
3
4
8
7
6
5
NC
NCNC
EP
9
V
IN
+
V
OUT
V
SS
V
IN
-
MCP631
SOT-23-5
V
DD
1
2
3
4
5
CS
V
IN
+
V
OUT
V
SS
V
IN
-
MCP633
SOT-23-6
V
DD
1
2
3
4
5
6