Datasheet

 2009-2011 Microchip Technology Inc. DS22197B-page 27

MCP631/2/3/4/5/9

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Device Code

MCP632 DABM

Note: Applies to 8-Lead 3x3 DFN

8-Lead DFN (3x3)(MCP632) Example

DABM

1131

256

8-Lead SOIC (150 mil) (MCP631, MCP632, MCP633)

Example:

NNN

MCP631E

SN ^^1131

256

Example:

5-Lead SOT-23

(MCP631)

6-Lead SOT-23 ( MCP633)

Example:

XXNN

YV25

XXNN

JC25