Datasheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: Input Offset Voltage.
- FIGURE 2-2: Input Bias Current at TA = +85˚C.
- FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage, with VDD = 2.0V.
- FIGURE 2-4: Input Offset Voltage Drift.
- FIGURE 2-5: Input Bias Current at TA = +125˚C.
- FIGURE 2-6: Input Offset Voltage vs. Common Mode Input Voltage, with VDD = 5.5V.
- FIGURE 2-7: Common Mode Input Voltage Range Lower Limit vs. Temperature.
- FIGURE 2-8: Input Offset Voltage vs. Output Voltage.
- FIGURE 2-9: CMRR, PSRR vs. Frequency.
- FIGURE 2-10: Common Mode Input Voltage Range Upper Limit vs. Temperature.
- FIGURE 2-11: Input Bias, Input Offset Currents vs. Temperature.
- FIGURE 2-12: CMRR, PSRR vs. Temperature.
- FIGURE 2-13: Input Bias, Offset Currents vs. Common Mode Input Voltage, with TA = +85˚C.
- FIGURE 2-14: Quiescent Current vs. Supply Voltage.
- FIGURE 2-15: Open-Loop Gain, Phase vs. Frequency.
- FIGURE 2-16: Input Bias, Offset Currents vs. Common Mode Input Voltage, with TA = +125˚C.
- FIGURE 2-17: Output Voltage Headroom vs. Output Current Magnitude.
- FIGURE 2-18: Gain Bandwidth Product, Phase Margin vs. Temperature.
- FIGURE 2-19: Maximum Output Voltage Swing vs. Frequency.
- FIGURE 2-20: Input Noise Voltage Density vs. Frequency.
- FIGURE 2-21: Output Short Circuit Current vs. Supply Voltage.
- FIGURE 2-22: Slew Rate vs. Temperature.
- FIGURE 2-23: Input Noise Voltage Density vs. Common Mode Input Voltage, with f = 1 kHz.
- FIGURE 2-24: Channel-to-Channel Separation vs. Frequency (MCP6272 and MCP6274).
- FIGURE 2-25: Quiescent Current vs. Chip Select (CS) Voltage, with VDD = 2.0V (MCP6273 and MCP6275 only).
- FIGURE 2-26: Large Signal Non-inverting Pulse Response.
- FIGURE 2-27: Small Signal Non-inverting Pulse Response.
- FIGURE 2-28: Quiescent Current vs. Chip Select (CS) Voltage, with VDD = 5.5V (MCP6273 and MCP6275 only).
- FIGURE 2-29: Large Signal Inverting Pulse Response.
- FIGURE 2-30: Small Signal Inverting Pulse Response.
- FIGURE 2-31: Chip Select (CS) to Amplifier Output Response Time, with VDD = 2.0V (MCP6273 and MCP6275 only).
- FIGURE 2-32: Input Current vs. Input Voltage.
- FIGURE 2-33: Chip Select (CS) to Amplifier Output Response Time, with VDD = 5,5V (MCP6273 and MCP6275 only).
- FIGURE 2-34: The MCP6271/1R/2/3/4/5 Show no Phase Reversal.
- 3.0 Pin Descriptions
- 4.0 Application Information
- 4.1 Rail-to-Rail Inputs
- 4.2 Rail-to-Rail Output
- 4.3 Capacitive Loads
- 4.4 MCP6273/5 Chip Select
- 4.5 Cascaded Dual Op Amps (MCP6275)
- 4.6 Unused Amplifiers
- 4.7 Supply Bypass
- 4.8 PCB Surface Leakage
- 4.9 Application Circuits
- FIGURE 4-8: Active Full-wave Rectifier.
- FIGURE 4-9: Non-Inverting Integrator.
- FIGURE 4-10: Isolating the Load with a Buffer.
- FIGURE 4-11: Cascaded Gain Circuit Configuration.
- FIGURE 4-12: Difference Amplifier Circuit.
- FIGURE 4-13: Integrator Circuit with Active Compensation.
- FIGURE 4-14: Second Order Multiple Feedback Low-Pass Filter with an Extra Pole- Zero Pair.
- FIGURE 4-15: Second Order Sallen-Key Low-Pass Filter with an Extra Pole-Zero Pair and Chip Select.
- FIGURE 4-16: Capacitorless Second Order Low-Pass Filter with Chip Select.
- 5.0 Design Tools
- 6.0 Packaging Information
© 2008 Microchip Technology Inc. DS21810F-page 33
MCP6271/1R/2/3/4/5
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP6271: Single Op Amp
MCP6271T: Single Op Amp
(Tape and Reel)
(SOIC, MSOP, SOT-23-5)
MCP6271RT: Single Op Amp
(Tape and Reel) (SOT-23-5)
MCP6272: Dual Op Amp
MCP6272T: Dual Op Amp
(Tape and Reel) (SOIC, MSOP)
MCP6273: Single Op Amp with Chip Select
MCP6273T: Single Op Amp with Chip Select
(Tape and Reel)
(SOIC, MSOP, SOT-23-6)
MCP6274: Quad Op Amp
MCP6274T: Quad Op Amp
(Tape and Reel) (SOIC, TSSOP)
MCP6275: Dual Op Amp with Chip Select
MCP6275T: Dual Op Amp with Chip Select
(Tape and Reel) (SOIC, MSOP)
Temperature Range: E = -40°C to +125°C
Package: OT = Plastic Small Outline Transistor (SOT-23), 5-lead
(MCP6271, MCP6271R)
CH = Plastic Small Outline Transistor (SOT-23), 6-lead
(MCP6273)
MS = Plastic MSOP, 8-lead
P = Plastic DIP (300 mil Body), 8-lead, 14-lead
SN = Plastic SOIC, (150 mil Body), 8-lead
SL = Plastic SOIC (150 mil Body), 14-lead
ST = Plastic TSSOP (4.4 mm Body), 14-lead
PART NO. X /XX
PackageTemperature
Range
Device
Examples:
a) MCP6271-E/SN: Extended Temperature,
8LD SOIC package.
b) MCP6271-E/MS: Extended Temperature,
8LD MSOP package.
c) MCP6271-E/P: Extended Temperature,
8LD PDIP package.
d) MCP6271T-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 package.
a) MCP6271RT-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 package.
a) MCP6272-E/SN: Extended Temperature,
8LD SOIC package.
b) MCP6272-E/MS: Extended Temperature,
8LD MSOP package.
c) MCP6272-E/P: Extended Temperature,
8LD PDIP package.
d) MCP6272T-E/SN: Tape and Reel,
Extended Temperature,
8LD SOIC package.
a) MCP6273-E/SN: Extended Temperature,
8LD SOIC package.
b) MCP6273-E/MS: Extended Temperature,
8LD MSOP package.
c) MCP6273-E/P: Extended Temperature,
8LD PDIP package.
d) MCP6273T-E/CH: Extended Temperature,
6LD SOT-23 package.
a) MCP6274-E/P: Extended Temperature,
14LD PDIP package.
b) MCP6274T-E/SL: Tape and Reel,
Extended Temperature,
14LD SOIC package.
c) MCP6274-E/SL: Extended Temperature,
14LD SOIC package.
d) MCP6274-E/ST: Extended Temperature,
14LD TSSOP package.
a) MCP6275-E/SN: Extended Temperature,
8LD SOIC package.
b) MCP6275-E/MS: Extended Temperature,
8LD MSOP package.
c) MCP6275-E/P: Extended Temperature,
8LD PDIP package.
d) MCP6275T-E/SN: Tape and Reel,
Extended Temperature,
8LD SOIC package.
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